5SGXEA5K3F35C2LG

The 5SGXEA5K3F35C2LG is a Stratix® V GX Field Programmable Gate Array (FPGA) offered in a 1152‑FBGA (35×35) surface‑mount package. It delivers a high density of programmable logic and on‑chip memory suitable for commercial electronic systems that require large, integrated digital processing capability.

Designed for commercial temperature operation, this device targets applications that need extensive logic resources, substantial embedded RAM, and a high I/O count in a compact BGA footprint.

Key Features

• Logic Capacity  Approximately 490,000 logic elements, providing a large resource pool for complex digital designs.
• Embedded Memory  Approximately 46.08 Mbits of on‑chip RAM for buffering, packet storage, and intermediate data processing.
• I/O and Package  432 user I/Os in a 1152‑FBGA (35×35) surface‑mount package (1152‑BBGA, FCBGA) for high‑density board integration.
• Power Supply  Core voltage supply range of 820 mV to 880 mV to support precise low‑voltage core operation.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS compliant for environmental regulatory alignment.
• Documentation  Part of the Stratix V family with detailed electrical and switching characteristics provided in the Stratix V device datasheet.

Typical Applications

• High‑density programmable computing  Implement large custom accelerators and complex state machines using the device’s extensive logic resources and embedded RAM.
• High‑I/O systems and interface bridging  Support systems that require many external connections and dense routing using 432 programmable I/Os in a compact FBGA package.
• Data buffering and streaming  On‑chip memory capacity is well suited for buffering, packet handling, and streaming data tasks within a single FPGA.

Unique Advantages

• High programmable capacity: Large logic element count enables consolidation of complex functions onto a single device, reducing board‑level component count.
• Substantial on‑chip memory: Approximately 46 Mbits of embedded RAM helps minimize reliance on external memory and reduces system latency.
• Dense I/O in a compact package: 432 I/Os in a 1152‑FBGA (35×35) footprint support high‑density system designs while conserving PCB area.
• Commercial temperature readiness: Rated 0 °C to 85 °C to meet typical commercial deployment environments and simplify qualification for such applications.
• Low core‑voltage operation: Narrow core supply range (820–880 mV) facilitates efficient core power delivery and predictable power budgeting.
• Regulatory compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGXEA5K3F35C2LG?

This Stratix V GX FPGA combines a high count of logic elements and significant embedded memory with a large I/O complement in a single 1152‑FBGA package, making it well suited for commercial designs that require integrated, high‑capacity programmable logic. Its defined operating voltage range and commercial temperature rating allow for predictable power and thermal planning.

Engineers and procurement teams looking to consolidate functionality, reduce board complexity, and leverage the Stratix V family documentation will find this device appropriate for demanding digital processing and I/O‑intensive applications.

Request a quote or submit an RFQ today to get pricing and availability for 5SGXEA5K3F35C2LG.