5SGXEA5K3F35C3N

The 5SGXEA5K3F35C3N is a Stratix® V GX field-programmable gate array (FPGA) IC from Intel. It delivers high logic capacity and substantial on-chip memory in a high-pin-count BGA package designed for surface-mount assembly.

With 490,000 logic elements, approximately 46 Mbits of embedded RAM and 432 general-purpose I/O pins, this commercial-grade device is targeted at designs that require dense programmable logic, significant embedded memory, and large I/O integration while operating within standard commercial temperature and voltage ranges.

Key Features

• Core Architecture: Stratix® V GX family FPGA core as specified in the device datasheet.
• Logic Capacity: 490,000 logic elements to support complex digital logic implementations.
• Embedded Memory: Approximately 46 Mbits of on-chip RAM for data buffering, state storage, and memory-intensive functions.
• I/O Resources: 432 I/O pins to connect multiple peripherals, buses, and interfaces without extensive external glue logic.
• Power Supply: Core voltage range 820 mV to 880 mV to guide power-supply design and budgeting.
• Package & Mounting: 1152-BBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount FCBGA package for high-density board integration.
• Operating Conditions: Commercial temperature grade rated 0 °C to 85 °C.
• Environmental Compliance: RoHS compliant.
• Family-Level Transceiver Options: The Stratix V GX family includes documented transceiver speed-grade options and electrical characteristics in the Stratix V device datasheet.

Typical Applications

• High-density digital processing: Implement complex state machines, datapaths, and custom logic functions using 490,000 logic elements and extensive on-chip RAM.
• Multi-I/O system integration: Integrate multiple peripherals, buses and interface standards leveraging 432 available I/O pins to minimize external components.
• Prototyping and system-level validation: Use the high logic and memory capacity to validate and iterate complex system designs before ASIC implementation.

Unique Advantages

• High logic density: 490,000 logic elements enable implementation of large, feature-rich designs without fragmentation across multiple devices.
• Significant embedded memory: Approximately 46 Mbits of on-chip RAM reduces dependency on external memory, simplifying board design and improving latency.
• Large I/O count: 432 I/O pins provide flexibility to connect numerous sensors, interfaces, and high-speed peripherals directly to the FPGA.
• Compact, manufacturable package: 1152-ball FCBGA (35×35) surface-mount package delivers high pin density in a board-friendly form factor.
• Predictable power domain: Defined core supply range (820–880 mV) helps streamline power-supply planning and thermal considerations.
• Commercial-grade and compliant: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial applications.

Why Choose 5SGXEA5K3F35C3N?

The 5SGXEA5K3F35C3N combines high logic capacity, substantial embedded RAM and a large I/O complement in a single Stratix V GX FPGA package. Its specification set supports complex, memory‑intensive designs and high I/O integration while remaining within commercial operating ranges.

This device suits teams and projects that need scalable programmable logic density, on-chip memory to reduce external component count, and a compact BGA package for high-density board layouts. The Stratix V family documentation provides additional device- and family-level electrical and timing characteristics to support design planning and integration.

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