5SGXEA5K3F35I3G

The 5SGXEA5K3F35I3G is a Stratix® V GX Field Programmable Gate Array (FPGA) from Intel, delivered in a 1152‑ball FCBGA package for surface‑mount assembly. This industrial‑grade device combines high logic density, significant on‑chip memory, and a large I/O count to address demanding programmable logic designs.

Key attributes include approximately 490,000 logic elements, roughly 46.08 Mbits of embedded RAM, and 432 I/O pins, making the device suited to designs that require substantial programmable resources within an extended operating temperature range.

Key Features

• Core Logic Density  Approximately 490,000 logic elements and 185,000 LABs/CLBs provide substantial programmable fabric for complex logic and custom implementations.
• On‑Chip Memory  Approximately 46.08 Mbits of embedded RAM for buffering, state storage, and memory‑intensive processing.
• I/O Capacity  432 available I/O pins to support wide parallel interfaces and multiple peripheral connections.
• Power Domain  Core voltage supply specified between 820 mV and 880 mV for the device core domain.
• Package & Mounting  1152‑BBGA (FCBGA) 35×35 supplier package; surface‑mount device optimized for compact board layouts.
• Temperature & Grade  Industrial grade operation rated from −40 °C to 100 °C for deployments that require extended temperature range.
• Environmental Compliance  RoHS‑compliant manufacturing status.

Typical Applications

• High‑density programmable logic systems  Use the device where large numbers of logic elements and routing resources are required to implement complex digital functions.
• Memory‑intensive designs  Leverage approximately 46.08 Mbits of embedded RAM for buffering, packet processing, or on‑chip data storage.
• I/O‑heavy systems  Deploy in applications that need broad parallel interfacing or many peripheral connections using 432 I/O pins.
• Industrial applications with extended temperature ranges  Suitable for systems that must operate reliably from −40 °C to 100 °C.

Unique Advantages

• Substantial programmable capacity: Approximately 490,000 logic elements enable large, feature‑rich FPGA implementations without partitioning across multiple devices.
• Significant on‑chip memory: About 46.08 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• High I/O count: 432 I/O pins simplify board‑level design for data‑intensive and multi‑interface applications.
• Industrial temperature range: Rated −40 °C to 100 °C to meet the thermal requirements of harsher operating environments.
• Compact BGA packaging: 1152‑BBGA FCBGA package supports dense PCB integration while maintaining a high pin‑count footprint.
• RoHS compliant: Conforms to environmental manufacturing requirements for reduced hazardous substances.

Why Choose 5SGXEA5K3F35I3G?

The 5SGXEA5K3F35I3G offers a combination of high logic density, substantial embedded memory, and wide I/O capability in an industrial‑grade Stratix V GX FPGA. Its specification set—including approximately 490,000 logic elements, roughly 46.08 Mbits of on‑chip RAM, 432 I/O pins, and an operating range from −40 °C to 100 °C—positions it for demanding programmable logic tasks where integration and reliability matter.

Manufactured by Intel as part of the Stratix V family, this device is appropriate for engineers and procurement teams seeking a high‑resource FPGA in a compact 1152‑ball FCBGA package with RoHS compliance and defined core voltage requirements.

Request a quote or submit a pricing inquiry to obtain availability, lead times, and ordering information for the 5SGXEA5K3F35I3G.