5SGXEA5K3F35I3LN

The 5SGXEA5K3F35I3LN is an Intel Stratix® V GX Field Programmable Gate Array (FPGA) designed for implementations that require high logic density, substantial on‑chip memory, and a large number of I/Os. The device provides 490,000 logic elements, approximately 46 Mbits of embedded RAM, and 432 I/Os in a 1152‑BBGA (35×35) FCBGA package.

Specified for industrial use, this surface‑mount FPGA operates from a core supply range of 820 mV to 880 mV and an ambient temperature range of −40 °C to 100 °C, making it appropriate for designs that demand robust temperature support and high integration.

Key Features

• Core Logic  490,000 logic elements for consolidating complex digital functions and implementing large custom logic blocks.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM to support memory‑intensive logic, buffering, and intermediate storage.
• I/O Capacity  432 general‑purpose I/Os to support wide external device interfacing and high pin‑count requirements.
• Power  Core voltage supply range of 820 mV to 880 mV to match system power-rail requirements and enable predictable power budgeting.
• Package & Mounting  1152‑BBGA, FCBGA (supplier designation 1152‑FBGA 35×35) in a surface‑mount form factor for compact, high‑density PCB layouts.
• Temperature & Grade  Industrial temperature grade with an operating range of −40 °C to 100 °C for deployment in temperature‑challenging environments.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control & Automation  Consolidates complex control algorithms and large I/O counts while operating across an industrial temperature range.
• High‑Density Data Processing  Implements large custom processing blocks and buffering using 490,000 logic elements and approximately 46 Mbits of embedded memory.
• I/O Aggregation & Protocol Bridging  Aggregates and translates multiple external interfaces using the device’s 432 I/Os for dense system interconnection.

Unique Advantages

• High logic density: 490,000 logic elements enable consolidation of multiple functions into a single device, reducing system complexity.
• Substantial on‑chip memory: Approximately 46 Mbits of embedded RAM supports latency‑sensitive buffering and internal data storage without external memory.
• Extensive I/O count: 432 I/Os provide flexibility for high‑pin‑count designs and varied peripheral interfaces.
• Industrial temperature capability: Rated from −40 °C to 100 °C for deployments where environmental robustness matters.
• Compact, manufacturable package: 1152‑BBGA (35×35) FCBGA surface‑mount package supports dense PCB integration and automated assembly.
• Regulatory compliance: RoHS compliant for easier environmental and supply‑chain alignment.

Why Choose 5SGXEA5K3F35I3LN?

The 5SGXEA5K3F35I3LN delivers a balance of high logic capacity, significant embedded memory, and a large I/O complement in an industrial‑rated Stratix V GX FPGA. It is well suited for engineers and system designers who need to consolidate complex digital functions and memory‑heavy logic into a single, compact package while maintaining operation across a broad temperature range.

As a member of the Stratix V family, this FPGA is positioned for designs that require scalability and dense integration—offering a platform where logic, memory, and I/O resources are co‑located to simplify board-level architecture and reduce bill‑of‑materials overhead.

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