5SGXEA5K3F35I3N

The 5SGXEA5K3F35I3N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC designed for high-density, high-integration designs. It combines a large logic fabric with substantial on-chip RAM and a high I/O count, packaged in a 1152-ball BGA for surface-mount assembly.

Configured and graded for industrial environments, this device is intended for applications that require significant programmable logic capacity, abundant embedded memory, and robust operating temperature range.

Key Features

• Logic Capacity  Approximately 490,000 logic elements (LEs) to implement large-scale digital designs and complex logic functions.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM for buffering, lookup tables, and local data storage.
• High I/O Count  432 user I/O pins to simplify interfacing with multiple peripherals, memories, and external devices.
• Package & Mounting  1152-ball BGA (FCBGA) supplier package 1152-FBGA (35×35); surface-mount mounting for PCB assembly.
• Voltage Supply  Core supply range specified at 820 mV to 880 mV for device operation.
• Industrial Temperature Grade  Rated for operation from −40°C to 100°C, suitable for industrial-temperature applications.
• Standards Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Large-scale logic implementations and algorithm acceleration using the device's substantial logic element count and embedded RAM.
• Industrial control systems  Industrial temperature grading and wide operating range support deployments in factory automation and process control.
• Multi-interface system hubs  High I/O count enables aggregation and bridging of multiple peripherals, sensors, and memory interfaces on a single FPGA.
• Prototyping and system integration  Surface-mount 1152-BBGA package and programmable logic make the device suitable for system-level prototyping and integration tasks.

Unique Advantages

• High logic density: The approximately 490k logic elements allow consolidation of complex functions into a single device, reducing board-level component count.
• Substantial embedded memory: Approximately 46 Mbits of on-chip RAM supports local data storage and high-throughput buffering without external memory.
• Large I/O complement: 432 I/Os simplify connectivity to external devices and sensors, minimizing the need for additional interface components.
• Industrial-grade thermal range: Specified −40°C to 100°C operation supports deployment in demanding temperature environments.
• Low-voltage core operation: Core supply between 820 mV and 880 mV enables designs that target modern low-voltage power domains.
• RoHS compliant packaging: Environmentally compliant for regions and programs requiring RoHS adherence.

Why Choose 5SGXEA5K3F35I3N?

The 5SGXEA5K3F35I3N positions itself as a high-capacity Stratix® V GX FPGA option where significant logic resources, plentiful on-chip RAM, and a high I/O count are required within an industrial temperature envelope. Its 1152-ball BGA packaging and surface-mount profile support standard board assembly processes while the device’s low-voltage core and RoHS compliance address modern power and regulatory needs.

This device is appropriate for engineering teams designing complex digital systems that benefit from consolidating functions into a single programmable device—reducing BOM complexity and enabling tighter system integration across industrial and high-density applications.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGXEA5K3F35I3N.