5SGXEA5K3F35I3LG

The 5SGXEA5K3F35I3LG is an Intel Stratix V GX field-programmable gate array (FPGA) supplied in a 1152‑BBGA (FCBGA) package. It combines a large programmable logic fabric with substantial on-chip RAM and a high I/O count to support complex digital designs.

Designed for industrial-grade operation, the device supports an extended operating temperature range and family transceiver speed grades described in the Stratix V GX datasheet, making it suited to applications that require dense logic, embedded memory, and multi‑gigabit serial connectivity options.

Key Features

• Programmable logic: Approximately 490,000 logic elements provide extensive capacity for complex digital functions and system integration.
• Embedded memory: Approximately 46.08 Mbits of on-chip RAM to support buffering, packet processing, and local data storage without immediate dependence on external memory.
• I/O and package: 432 I/Os in a 1152‑BBGA (FCBGA) package; supplier device package listed as 1152‑FBGA (35×35). Surface-mount mounting type simplifies PCB assembly for compact, high-density boards.
• Industrial temperature grade: Rated for operation from −40 °C to 100 °C, suitable for systems requiring extended temperature performance.
• Power supply: Core voltage supply specified from 820 mV to 880 mV to support predictable power budgeting and thermal planning.
• High-speed transceiver options (Stratix V GX family): Datasheet lists transceiver speed grades for the Stratix V GX family including channel rates such as 14.1 Gbps, 12.5 Gbps, and 8.5 Gbps depending on speed grade selection.
• Regulatory compliance: RoHS compliant.

Typical Applications

• High-speed serial communications: Leverage Stratix V GX family transceiver grades and on-chip resources for multi‑gigabit serial links and protocol bridging.
• Network and telecom infrastructure: Use the device’s logic density and embedded memory for packet processing, line cards, and data-plane functions.
• Industrial and harsh-environment systems: The industrial temperature range makes the device suitable for control systems and instrumentation deployed outside standard commercial temperature envelopes.
• FPGA-based acceleration and prototyping: Large logic fabric and significant on-chip RAM enable implementation of hardware-accelerated algorithms and system prototypes.

Unique Advantages

• Large programmable fabric: Approximately 490,000 logic elements reduce the need for multiple devices and simplify system partitioning.
• Substantial on-chip memory: Approximately 46.08 Mbits of embedded RAM supports local buffering and state storage, lowering external memory bandwidth requirements.
• High I/O density in a compact package: 432 I/Os in a 1152‑BBGA (35×35) package give designers many external interface options while keeping board area compact.
• Industrial operating range: −40 °C to 100 °C qualification provides headroom for temperature-challenged deployments.
• Predictable power envelope: Defined core supply range (820–880 mV) supports accurate power budgeting and thermal design.
• Family-level high-speed connectivity: Stratix V GX transceiver speed grades documented in the datasheet enable selection of suitable channel rates for multi‑gigabit links.

Why Choose 5SGXEA5K3F35I3LG?

This Intel Stratix V GX device delivers a combination of high logic capacity, significant embedded memory, and extensive I/O in a 1152‑BBGA package targeted at complex digital systems. Its industrial temperature rating and clearly defined electrical requirements allow engineers to design for reliability across a wide range of operating conditions.

Choose 5SGXEA5K3F35I3LG when your design requires a scalable, high‑density FPGA platform with family-level transceiver options, predictable power parameters, and compliance with RoHS. Documentation and electrical characteristics are provided in the Stratix V device datasheet to support system-level design and verification.

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