5SGXEA5K3F35I3L

The 5SGXEA5K3F35I3L is a Stratix V GX field programmable gate array (FPGA) IC from Intel, packaged in a 1152‑BBGA FCBGA (35×35) footprint. It provides a high logic capacity with 490,000 logic elements and approximately 46 Mbits of embedded memory, targeted at complex, high‑density digital designs.

With 432 I/O, support for industrial temperature operation, and a low core supply range, this device is suited for applications that require large on‑chip logic and memory resources together with extensive I/O connectivity and industrial operating range.

Key Features

• Core Logic  490,000 logic elements to implement high‑complexity digital functions and system integration on a single device.
• Embedded Memory  Approximately 46 Mbits of on‑chip RAM for buffering, large state storage, and memory‑intensive algorithms.
• I/O Count  432 device I/Os for wide external interfacing and dense system connectivity.
• Transceiver & I/O Capabilities (Series Info)  Stratix V GX devices in the series include defined transceiver specifications and I/O timing features in the device datasheet, supporting high‑speed serial and programmable I/O timing requirements.
• Power  Core supply range specified at 820 mV to 880 mV for designs targeting this low‑voltage operating point.
• Package & Mounting  1152‑BBGA, FCBGA package (supplier package 1152‑FBGA, 35×35) optimized for surface‑mount assembly in space‑constrained systems.
• Industrial Grade & Temperature Range  Industrial grade device with an operating temperature range of −40 °C to 100 °C for temperature‑challenging environments.
• RoHS Compliant  Device is compliant with RoHS environmental requirements.

Typical Applications

• High‑speed serial systems  Designs that leverage Stratix V GX transceiver capabilities and programmable I/O timing for high‑bandwidth data links.
• Complex digital processing  Systems requiring extensive logic and on‑chip RAM to implement large state machines, protocol stacks, or custom accelerators.
• Industrial control and automation  Applications that benefit from 432 I/O and an industrial temperature rating for robust operation in demanding environments.

Unique Advantages

• High integration density: 490,000 logic elements enable consolidation of complex functions onto a single FPGA, reducing external components and board area.
• Substantial on‑chip memory: Approximately 46 Mbits of embedded RAM supports buffering and large local datasets without relying on external memory.
• Extensive I/O connectivity: 432 I/O pins provide flexibility to interface with multiple peripherals, sensors, and high‑speed links.
• Industrial temperature support: Rated for −40 °C to 100 °C operation, suitable for temperature‑sensitive deployments.
• Low‑voltage core operation: 820–880 mV core supply range aligns with low‑voltage design targets and power management strategies.
• Standard surface‑mount package: 1152‑BBGA (35×35) FCBGA package supports modern PCB assembly and compact system designs.

Why Choose 5SGXEA5K3F35I3L?

The 5SGXEA5K3F35I3L brings significant logic capacity, substantial embedded memory, and broad I/O in an industrial‑rated Stratix V GX FPGA package. It is positioned for designs that require on‑chip integration of complex digital logic alongside robust I/O and memory resources, while meeting industrial temperature demands.

As part of the Stratix V GX family from Intel, this device provides a verified hardware footprint and documented electrical and switching characteristics for engineering teams focused on scalable, high‑density FPGA implementations.

Request a quote or submit an inquiry for pricing and availability to begin evaluating 5SGXEA5K3F35I3L for your next design.