5SGXEA5N3F40I3N

The 5SGXEA5N3F40I3N is a Stratix® V GX family FPGA from Intel, configured as a high-density, industrial-grade programmable logic device. It integrates 185,000 CLBs and 490,000 logic elements with approximately 46 Mbits of embedded RAM and up to 600 user I/O to address complex system designs.

Designed for industrial environments, this surface-mount FCBGA device operates from 820 mV to 880 mV core supply and supports an operating temperature range of −40 °C to 100 °C, providing a platform for high‑integration digital, signal‑processing and I/O‑intensive applications.

Key Features

• Stratix V GX architecture  Part of the Stratix V GX device family for high-density, programmable logic implementations.
• High logic capacity  185,000 CLBs (logic array blocks) comprising 490,000 logic elements for large, complex designs.
• Embedded memory  Approximately 46 Mbits of on‑chip RAM to support large buffering, lookup tables, and DSP data storage.
• Extensive I/O  Up to 600 I/O pins to support broad peripheral, interface and system integration requirements.
• Power and core supply  Core voltage supply range of 820 mV to 880 mV for defined power provisioning and board design.
• Industrial temperature grade  Rated for operation from −40 °C to 100 °C for deployment in industrial environments.
• Package and mounting  1517‑BBGA (FCBGA) supplier device package — 1517‑FBGA (40×40) in a surface‑mount format for compact board layouts.
• Compliance  RoHS compliant.

Typical Applications

• Industrial control and automation  Industrial-grade temperature range and high I/O count enable robust sensor, actuator and control interfacing.
• High-density digital signal processing  Large logic element count and ~46 Mbits of embedded RAM support complex DSP pipelines and buffering.
• Communications and networking  Stratix V GX family architecture and 600 I/O provide a platform for I/O‑intensive network and telecom functions.
• Prototyping and system integration  High logic capacity and extensive I/O make the device suitable for complex prototype and integration tasks.

Unique Advantages

• High integration density: 490,000 logic elements combined with 185,000 CLBs enable consolidation of large logic designs into a single device.
• Substantial on‑chip RAM: Approximately 46 Mbits of embedded memory reduces external memory dependencies and simplifies board layout.
• Large I/O budget: Up to 600 I/O pins provide flexibility for multiple interfaces and high connector counts without additional bridging logic.
• Industrial readiness: −40 °C to 100 °C operating range and industrial grade designation support deployment in demanding environments.
• Compact surface-mount package: 1517‑FBGA (40×40) FCBGA packaging enables dense PCB designs while maintaining high pin count.
• Standards‑aligned compliance: RoHS compliance simplifies regulatory alignment for commercial and industrial products.

Why Choose 5SGXEA5N3F40I3N?

The 5SGXEA5N3F40I3N combines high logic density, substantial embedded memory and a large I/O complement in an industrial‑grade Stratix V GX FPGA package. It is well suited for engineers tackling complex digital architectures, high‑throughput signal processing, and I/O‑heavy system integrations where on‑chip resources and thermal robustness matter.

Backed by Intel’s Stratix V family documentation and design ecosystem, this device offers a scalable platform for long‑lifecycle industrial designs that require consolidated logic, memory, and I/O in a single, surface‑mount FCBGA package.

Request a quote or submit an inquiry to get pricing and availability for 5SGXEA5N3F40I3N and discuss how this Stratix V GX FPGA can meet your next high‑density design challenge.