5SGXEA5N3F45C2G

The 5SGXEA5N3F45C2G is a Stratix V GX Field Programmable Gate Array (FPGA) from Intel. This device provides a high-density programmable logic fabric with a large number of I/O and substantial embedded RAM, delivered in a 1932-BBGA/FCBGA package.

With defined commercial temperature grading and a narrow core voltage window, the device is intended for designs that require significant on-chip logic, abundant I/O connectivity, and sizable embedded memory resources.

Key Features

• Logic Capacity  185,000 LABs and 490,000 logic elements (cells) provide substantial programmable logic resources for complex designs.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM to support large data buffers, FIFOs, and memory-intensive logic.
• I/O Density  840 user I/Os to accommodate extensive peripheral and high-pin-count interface requirements.
• Package  1932-BBGA, FCBGA (supplier package noted as 1932-FBGA, FC (45x45)) for high-pin-count board-level integration.
• Power  Specified core supply voltage range of 870 mV to 930 mV for core power planning and regulator selection.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards & Compliance  RoHS compliant.
• Series Transceiver Capability (Series Reference)  Stratix V GX family devices (series-level) include transceiver speed grade options up to the values listed in the device datasheet.

Typical Applications

• High-density programmable logic  Implement large custom datapaths and control logic using the device’s 490,000 logic elements and 185,000 LAB resources.
• Memory-intensive algorithms  Leverage approximately 46.08 Mbits of embedded RAM for buffering, packet processing, or other on-chip storage needs.
• High-pin-count interface bridging  Use the 840 I/Os to connect multiple external interfaces, sensors, or parallel buses without external multiplexing.

Unique Advantages

• High logical integration: Large logic element count enables consolidation of complex functions into a single device, reducing board-level component count.
• Substantial on-chip memory: Approximately 46.08 Mbits of embedded RAM lowers reliance on external memory for many buffer and caching tasks.
• Extensive I/O capability: 840 I/Os provide flexibility for multi-channel interfaces and high-density connectivity requirements.
• Compact, high-pin package: 1932-BBGA / FCBGA packaging supports high I/O in a single footprint for dense PCB implementations.
• Defined operating envelope: Commercial grade operation from 0 °C to 85 °C and a specified core voltage range simplifies system power and thermal planning.
• RoHS compliant: Meets RoHS environmental requirements for regulated markets.

Why Choose 5SGXEA5N3F45C2G?

This Stratix V GX device positions itself as a high-density FPGA option for designs that require large amounts of programmable logic, significant embedded RAM, and a high number of I/Os in a single package. The combination of 490,000 logic elements, approximately 46.08 Mbits of on-chip RAM, and 840 I/Os makes it suitable for complex, integration-forward designs where board-level simplification and on-chip resources are priorities.

Backed by Intel’s Stratix V family documentation and series-level transceiver information, the device offers a defined commercial operating range and RoHS compliance, providing clear parameters for power, thermal, and regulatory planning during product development.

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