5SGXEA5N3F45C2LN

The 5SGXEA5N3F45C2LN is a Stratix® V GX family FPGA in a 1932-ball FCBGA package designed for high-density, commercially graded applications. It combines a large logic fabric, substantial embedded memory, and a high I/O count to address complex digital designs where integration density and I/O capacity matter.

This device is commercial grade (0 °C to 85 °C), RoHS compliant, and operates at a core supply range of 820 mV to 880 mV. It is supplied in a surface-mount 1932-FBGA (45 × 45 mm) package.

Key Features

• Core Logic  Approximately 490,000 logic elements, with around 185,000 logic array blocks for implementing large-scale digital logic and custom architectures.
• Embedded Memory  Approximately 46.08 Mbits of on-chip RAM, providing substantial on-device buffering and storage for state machines, FIFOs, and algorithmic data.
• I/O Capacity  Up to 840 I/O pins to support wide parallel interfaces, multi-channel connectivity, and complex board-level integration.
• Power  Core voltage specified from 820 mV to 880 mV to match precise power domains and system-level power design.
• Package & Mounting  1932-ball BGA (FCBGA) surface-mount package, supplier package noted as 1932-FBGA, FC (45 × 45 mm) for high-density board designs.
• Operating Range & Compliance  Commercial temperature grade (0 °C to 85 °C) and RoHS compliant for standard commercial product deployments.
• Series-Level Transceiver Information  As a Stratix V GX family device, the series datasheet documents GX transceiver speed grades (series-level) used across the family.

Typical Applications

• High-performance Digital Processing  Large logic capacity and embedded memory make this device suitable for compute-heavy FPGA tasks such as signal processing pipelines and real-time data manipulation.
• Communications & Networking  High I/O counts and Stratix V GX family transceiver capabilities (series-level) support multi-channel interfaces and bandwidth-dense line cards.
• Instrumentation & Test  Substantial on-chip RAM and abundant I/O enable complex data capture, buffering, and control functions in lab and production test equipment.
• Prototype & System Integration  Dense logic and BGA packaging facilitate system-level prototyping and integration where board space and integration density are priorities.

Unique Advantages

• High Logic Density:  Approximately 490,000 logic elements allow larger designs to be implemented in a single device, reducing multi‑device partitioning.
• Significant On‑Chip Memory:  Around 46.08 Mbits of embedded RAM supports deep buffering and state retention without external memory overhead.
• Extensive I/O Resources:  840 I/O pins simplify interfacing to multiple peripherals and high-channel-count systems, lowering PCB routing complexity.
• Commercial Temperature & RoHS Compliance:  Commercial temperature rating (0 °C to 85 °C) and RoHS compliance meet typical commercial deployment and environmental requirements.
• Compact High‑Density Package:  1932-ball FCBGA (45 × 45 mm) surface-mount package delivers high pin count in a compact footprint for dense system boards.
• Documented Series Support:  Device is part of the Stratix V GX family with published device datasheet content for electrical characteristics and operating requirements.

Why Choose 5SGXEA5N3F45C2LN?

The 5SGXEA5N3F45C2LN positions itself as a high-density, commercially graded FPGA option in the Stratix V GX family for engineers who need extensive logic resources, on-chip memory, and a large I/O complement in a single, surface-mount BGA package. Its specified core voltage range and operating temperature make it suitable for a wide range of commercial electronic systems.

With detailed device documentation available for the Stratix V family, this FPGA is appropriate for teams building complex digital processing, communications, and instrumentation solutions that benefit from consolidated logic and memory resources on a single device.

Request a quote or submit an inquiry for pricing and availability to move your design forward with the 5SGXEA5N3F45C2LN.