5SGXEA5N3F45C3N
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,785 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 185000 | Number of Logic Elements/Cells | 490000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGXEA5N3F45C3N – Stratix V GX FPGA, 490,000 logic elements
The 5SGXEA5N3F45C3N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC offering 490,000 logic elements and 185,000 LABs (logic array blocks). It integrates approximately 46 Mbits of embedded RAM and supports up to 840 I/O pins in a 1932-BBGA FCBGA package with surface-mount mounting.
Targeted for commercial-grade designs, this device operates from a core supply range of 820 mV to 880 mV and across an ambient temperature range of 0 °C to 85 °C, providing a highly integrated logic-and-memory platform in a large BGA footprint.
Key Features
- Logic Capacity 490,000 logic elements and 185,000 LABs (logic array blocks) provide substantial on-chip programmable logic resources.
- Embedded Memory Approximately 46 Mbits of on-chip RAM for user designs and buffering needs.
- I/O Count Up to 840 general-purpose I/O pins to support extensive peripheral and board-level connectivity.
- Power Core voltage supply range of 820 mV to 880 mV for device operation.
- Package & Mounting 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount ready.
- Operating Range & Grade Commercial-grade device with operating temperature specified from 0 °C to 85 °C.
- Compliance RoHS-compliant for environmental and manufacturing requirements.
Unique Advantages
- High logic density: 490,000 logic elements and 185,000 LABs enable complex, large-scale programmable designs without immediate need for multi-device partitioning.
- Significant on-chip memory: Approximately 46 Mbits of embedded RAM reduces dependence on external memory for many buffering and stateful functions.
- Extensive I/O capability: 840 I/Os support broad board-level connectivity and rich peripheral interfacing from a single package.
- Robust package footprint: 1932-BBGA (45×45) package provides the pin count and routing real estate needed for dense designs.
- Commercial temperature suitability: Rated for 0 °C to 85 °C operation for standard commercial applications and deployment environments.
- Regulatory readiness: RoHS compliance simplifies integration into lead-free manufacturing flows.
Why Choose 5SGXEA5N3F45C3N?
This Stratix V GX FPGA delivers a combination of large logic capacity, ample embedded memory, and high I/O count in a single commercial-grade FCBGA package. It is suited to projects that require consolidated programmable logic, sizable on-chip RAM, and extensive board connectivity while adhering to standard commercial temperature and power parameters.
Designers and procurement teams looking for a high-density FPGA solution with clear electrical and thermal operating points will find the 5SGXEA5N3F45C3N aligns with complex, memory- and I/O-intensive implementations while maintaining RoHS compliance.
Request a quote or submit an inquiry to receive pricing, availability, and additional technical information for the 5SGXEA5N3F45C3N. Detailed electrical and switching characteristics are available in the device datasheet upon request.

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