5SGXEA5N3F45C3N

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 840 46080000 490000 1932-BBGA, FCBGA

Quantity 1,785 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs185000Number of Logic Elements/Cells490000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGXEA5N3F45C3N – Stratix V GX FPGA, 490,000 logic elements

The 5SGXEA5N3F45C3N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC offering 490,000 logic elements and 185,000 LABs (logic array blocks). It integrates approximately 46 Mbits of embedded RAM and supports up to 840 I/O pins in a 1932-BBGA FCBGA package with surface-mount mounting.

Targeted for commercial-grade designs, this device operates from a core supply range of 820 mV to 880 mV and across an ambient temperature range of 0 °C to 85 °C, providing a highly integrated logic-and-memory platform in a large BGA footprint.

Key Features

  • Logic Capacity  490,000 logic elements and 185,000 LABs (logic array blocks) provide substantial on-chip programmable logic resources.
  • Embedded Memory  Approximately 46 Mbits of on-chip RAM for user designs and buffering needs.
  • I/O Count  Up to 840 general-purpose I/O pins to support extensive peripheral and board-level connectivity.
  • Power  Core voltage supply range of 820 mV to 880 mV for device operation.
  • Package & Mounting  1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount ready.
  • Operating Range & Grade  Commercial-grade device with operating temperature specified from 0 °C to 85 °C.
  • Compliance  RoHS-compliant for environmental and manufacturing requirements.

Unique Advantages

  • High logic density: 490,000 logic elements and 185,000 LABs enable complex, large-scale programmable designs without immediate need for multi-device partitioning.
  • Significant on-chip memory: Approximately 46 Mbits of embedded RAM reduces dependence on external memory for many buffering and stateful functions.
  • Extensive I/O capability: 840 I/Os support broad board-level connectivity and rich peripheral interfacing from a single package.
  • Robust package footprint: 1932-BBGA (45×45) package provides the pin count and routing real estate needed for dense designs.
  • Commercial temperature suitability: Rated for 0 °C to 85 °C operation for standard commercial applications and deployment environments.
  • Regulatory readiness: RoHS compliance simplifies integration into lead-free manufacturing flows.

Why Choose 5SGXEA5N3F45C3N?

This Stratix V GX FPGA delivers a combination of large logic capacity, ample embedded memory, and high I/O count in a single commercial-grade FCBGA package. It is suited to projects that require consolidated programmable logic, sizable on-chip RAM, and extensive board connectivity while adhering to standard commercial temperature and power parameters.

Designers and procurement teams looking for a high-density FPGA solution with clear electrical and thermal operating points will find the 5SGXEA5N3F45C3N aligns with complex, memory- and I/O-intensive implementations while maintaining RoHS compliance.

Request a quote or submit an inquiry to receive pricing, availability, and additional technical information for the 5SGXEA5N3F45C3N. Detailed electrical and switching characteristics are available in the device datasheet upon request.

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