5SGXEA5N3F45C4N

The 5SGXEA5N3F45C4N is a Stratix® V GX field-programmable gate array (FPGA) device delivered in a 1932‑BBGA FCBGA package. It provides a high-density programmable fabric with significant on-chip memory and a large I/O count for complex digital designs.

Designed for commercial-temperature applications, this device targets systems that require high logic capacity, substantial embedded RAM, and a compact, surface-mount FCBGA footprint.

Key Features

• High logic capacity — 490,000 logic elements suitable for complex, multi-module designs and large-scale RTL integration.
• Embedded memory — 46,080,000 total RAM bits (approximately 46.1 Mbits) to support buffering, FIFOs, and on-chip data storage.
• Large I/O complement — 840 user I/O pins to support wide parallel interfaces, multi-channel connectivity, and dense peripheral integration.
• Core voltage — Low-voltage core operation specified from 820 mV to 880 mV for the device core supply.
• Commercial temperature grade — Operating temperature range of 0 °C to 85 °C for standard commercial applications.
• Package and mounting — 1932‑BBGA (supplier package: 1932‑FBGA, FC, 45×45) in a surface-mount format for high-density board layouts.
• Standards — RoHS compliant.

Typical Applications

• High-density digital signal processing — Leverage the 490,000 logic elements and ~46.1 Mbits of embedded RAM for DSP pipelines, packet processing, and algorithm acceleration.
• Multi-channel interface hubs — Use the 840 I/O pins to aggregate and manage numerous parallel and serial interfaces in communications and networking equipment.
• Prototyping and complex SoC emulation — Large logic and memory resources make the device suitable for emulating large IP blocks and validating system-level designs.
• High-performance compute peripherals — Integrate as a programmable offload engine where dense logic and on-chip memory reduce external memory bandwidth needs.

Unique Advantages

• Extensive programmable fabric: 490,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
• Significant on-chip RAM: Approximately 46.1 Mbits of embedded memory supports large buffers and reduces dependence on external memory.
• Massive I/O capability: 840 I/Os accommodate broad peripheral sets and parallel data paths without immediate need for I/O expanders.
• Compact, manufacturable package: 1932‑BBGA FCBGA in a 45×45 supplier footprint provides high pin density in a surface-mount form factor for modern PCB assembly.
• Low core-voltage operation: 820–880 mV core supply supports designs that optimize power at the FPGA core level.
• RoHS compliant: Meets common environmental compliance requirements for commercial electronics production.

Why Choose 5SGXEA5N3F45C4N?

The 5SGXEA5N3F45C4N balances high logic density, considerable embedded memory, and a broad I/O complement in a single Stratix V GX device. Its commercial-grade temperature range and surface-mount 1932‑BBGA package make it suitable for production systems where space, integration, and programmable capacity are priorities.

This device is well suited for engineering teams implementing complex processing pipelines, multi-interface controllers, or prototype SoC environments that require substantial on-chip resources and a high pin count. It supports long-term design scaling within the Stratix V family and leverages documented device characteristics to streamline system-level design choices.

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