5SGXEA5N3F45I3LG

The 5SGXEA5N3F45I3LG is an Intel Stratix® V GX field-programmable gate array (FPGA) in a 1932-ball FCBGA package targeted at industrial-grade applications. It combines large logic capacity, substantial on-chip memory, and a high I/O count to support complex digital designs that require extensive fabric resources and dense I/O integration.

As a member of the Stratix V GX family, this device aligns with the series’ electrical and switching characteristic framework and is suitable for designs that rely on abundant logic elements, embedded RAM, and configurable I/O resources.

Key Features

• Logic Capacity  490,000 logic elements, providing a high-density programmable fabric for complex logic, control, and datapath implementation.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive functions without external SRAM.
• I/O Density  840 dedicated I/O pins to support wide parallel interfaces, rich peripheral connectivity, and multi-channel designs.
• Package  1932-ball BGA (FCBGA) package (supplier package: 1932-FBGA, FC 45×45) designed for surface-mount PCB assembly and high-pin-count routing.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C, suitable for industrial-environment deployments.
• Core Supply Voltage  Core supply voltage specified from 820 mV to 880 mV, enabling designed power domains per device electrical requirements.
• RoHS Compliant  Device meets RoHS environmental requirements.
• Family-Level Characteristics  Aligned with Stratix V GX series electrical and switching specifications, including documented I/O timing and transceiver speed grade options in the family datasheet.

Typical Applications

• High‑density digital processing  Implement large-scale FPGA fabrics for complex control, signal-processing, or algorithm acceleration using extensive logic elements and embedded RAM.
• Multi‑interface systems  Support designs that require many parallel and serial interfaces thanks to the device’s 840 I/Os and high pin-count package.
• Industrial systems  Deploy in industrial-temperature environments where extended operating range (–40 °C to 100 °C) and RoHS compliance are required.

Unique Advantages

• High logic density: 490,000 logic elements allow consolidation of large designs onto a single device, reducing board-level complexity.
• Significant on‑chip memory: Approximately 46 Mbits of embedded RAM reduces dependence on external memory for buffering and intermediate storage.
• Extensive I/O capability: 840 I/Os enable broad connectivity and simplify routing of multi-channel or multi-protocol systems.
• Industrial-grade thermal range: Specified operation from –40 °C to 100 °C supports deployment in demanding environments.
• High‑pin-count packaging: The 1932-ball FCBGA package supports dense routing and high I/O count while maintaining a surface-mount footprint.
• Family-level engineering support: Conforms to the Stratix V GX series electrical and switching guidance, assisting integration with established design flows that reference the series datasheet.

Why Choose 5SGXEA5N3F45I3LG?

The 5SGXEA5N3F45I3LG offers a balanced combination of large logic capacity, substantial embedded memory, and a high I/O count in an industrial-temperature, RoHS-compliant package. These characteristics make it well suited for designers who need to implement dense digital logic, sizable on-chip buffering, and broad interface compatibility on a single FPGA.

Choosing this Stratix V GX device provides a clear path for designs that prioritize integration density and reliable operation across a wide temperature range, while remaining compatible with the electrical and switching specifications defined for the Stratix V family.

Request a quote or submit an inquiry to receive pricing, availability, and additional integration support for the 5SGXEA5N3F45I3LG.