5SGXEA5N3F45I3N

The 5SGXEA5N3F45I3N is an Intel Stratix® V GX field programmable gate array (FPGA) device offering high logic density and extensive embedded memory for complex designs. As a Stratix V GX device in a 1932-BBGA (FCBGA) package, it targets applications that require large programmable fabric, abundant I/O, and industrial temperature operation.

This device combines approximately 490,000 logic elements with roughly 46 Mbits of on-chip RAM, 840 user I/O pins, and is specified for industrial operation from –40 °C to 100 °C. It supports a core supply range of 820 mV to 880 mV and is supplied in a surface-mount, 1932-FBGA (45×45) package.

Key Features

• Core Logic Density  Approximately 490,000 logic elements provide the programmable fabric to implement large-scale digital designs and custom processing pipelines.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM supports deep buffering, large lookup tables, and embedded data storage for high-throughput designs.
• I/O Capacity  840 available I/O pins accommodate wide parallel interfaces, multi-channel connectivity, and extensive board-level integration.
• Stratix V GX Architecture  Part of the Stratix V GX family (device series referenced in the datasheet), supporting the electrical and switching characteristics defined for Stratix V devices.
• Power Supply  Core supply specified at 820 mV to 880 mV for compatible power-system design and voltage sequencing.
• Package & Mounting  Surface-mount 1932-BBGA (FCBGA) package, supplier device package listed as 1932-FBGA, FC (45×45), suitable for high-density PCB layouts.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C for deployment in industrial-environment applications.
• Standards Compliance  RoHS compliant for environmental and regulatory alignment.

Typical Applications

• High-speed communications  Leverage the Stratix V GX device family characteristics and high I/O count to implement multichannel serial and parallel communication endpoints.
• Signal processing and FPGA acceleration  Large logic element count and substantial on-chip RAM enable implementation of complex DSP pipelines and hardware accelerators.
• Networking and switching  High I/O capacity and Stratix V GX family capabilities make the device suitable for packet-processing, data-plane, and aggregation functions.
• Industrial control and automation  Industrial temperature rating and broad I/O support allow integration into rugged control systems and industrial instrumentation.

Unique Advantages

• High programmable density: With approximately 490,000 logic elements, the device supports large, feature-rich FPGA designs without partitioning across multiple devices.
• Significant embedded memory: Around 46 Mbits of on-chip RAM reduces external memory dependency for buffering and state storage, simplifying board design.
• Extensive I/O connectivity: 840 I/O pins enable broad peripheral interfacing and high-bandwidth external connections for multiport systems.
• Industrial temperature support: Specified operation from –40 °C to 100 °C facilitates deployment in demanding environmental conditions.
• Compact, high-density package: 1932-BBGA (45×45) FCBGA package supports dense PCB integration while maintaining a high pin count.
• RoHS compliant: Meets common environmental requirements for modern electronic assemblies.

Why Choose 5SGXEA5N3F45I3N?

The 5SGXEA5N3F45I3N positions itself as a high-density Stratix V GX FPGA option for engineers who need abundant logic resources, substantial embedded memory, and a large I/O fabric in an industrial-temperature, surface-mount package. Its specification set—approximately 490,000 logic elements, roughly 46 Mbits of on-chip RAM, 840 I/O, and 1932-BBGA packaging—supports complex signal processing, networking, and control designs where integration and reliability are key.

Designed within the Stratix V family, the device benefits from the documented electrical and switching characteristics of the series, enabling predictable system-level planning and integration into designs that require high logic capacity and robust thermal range.

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