5SGXEA7H1F35C1G

The 5SGXEA7H1F35C1G is a Stratix® V GX Field Programmable Gate Array in a 1152-BBGA (FCBGA) package. It delivers high-density programmable logic with 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 552 user I/Os.

Manufactured for commercial applications, the device operates at a core supply range of 870 mV to 930 mV and is rated for an operating temperature range of 0 °C to 85 °C. The part is RoHS compliant and provided as a surface-mount 1152-FBGA (35×35) package for compact PCB integration.

Key Features

• Core Logic  622,000 logic elements provide dense programmable logic resources for complex designs and parallel processing architectures.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM enables large buffers, FIFOs, and state-storage without extensive external memory.
• I/O Capacity  552 I/Os support extensive peripheral interfacing and system-level connections from a single device.
• Package & Mounting  1152-BBGA, FCBGA (supplier package: 1152-FBGA 35×35) in a surface-mount format for dense assembly and board-level integration.
• Power  Core voltage supply range of 870 mV to 930 mV allows precise power-domain design and management.
• Temperature & Grade  Commercial-grade device rated for 0 °C to 85 °C operating temperature.
• Regulatory  RoHS compliant to meet lead-free manufacturing requirements.

Typical Applications

• High-density logic implementation  Leverage 622,000 logic elements for complex finite-state machines, datapath engines, and heavy combinatorial logic.
• Large on-chip buffering  Approximately 51.2 Mbits of embedded memory supports data buffering, packet queues, and streaming applications without immediate external RAM.
• System integration and bridging  552 I/Os simplify integration between multiple subsystems and peripheral interfaces on a single board.

Unique Advantages

• High on-chip integration: Combining 622k logic elements with ~51.2 Mbits of embedded memory reduces dependence on external components and simplifies BOM.
• Extensive I/O count: 552 I/Os enable direct connections to multiple peripherals and subsystems, reducing the need for additional interface chips.
• Compact BGA package: 1152-BBGA (1152-FBGA 35×35) surface-mount package supports dense PCB layouts while maintaining high pin count.
• Commercial temperature grade: Rated 0 °C to 85 °C for standard commercial deployments and environmental conditions.
• RoHS compliant: Meets lead-free manufacturing requirements for regulatory and production consistency.
• Controlled core voltage range: Narrow 870 mV–930 mV supply window simplifies core power supply design and sequencing considerations.

Why Choose 5SGXEA7H1F35C1G?

The 5SGXEA7H1F35C1G positions itself as a high-density Stratix V GX FPGA option for designs that require significant on-chip logic and memory capacity combined with a large I/O footprint. Its 1152-BBGA surface-mount package supports compact, high-pin-count board layouts while maintaining RoHS compliance and commercial-temperature operation.

This part is suited to engineers seeking a single-device solution that consolidates logic, memory, and I/O resources to reduce system complexity and component count, backed by Stratix V device documentation and specifications.

Request a quote or submit an inquiry to check availability, pricing, and lead times for the 5SGXEA7H1F35C1G. Provide your quantity and any required delivery details to receive a prompt response.