5SGXEA7H1F35C1

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 51200000 622000 1152-BBGA, FCBGA

Quantity 377 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7H1F35C1 – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXEA7H1F35C1 is a Stratix V GX Field Programmable Gate Array from Intel, offered in a commercial temperature grade. This high-density FPGA delivers large on-chip logic and memory resources with a broad I/O complement, packaged in a 1152-ball FCBGA suitable for surface-mount assembly.

Engineered for designs that require significant programmable logic capacity, substantial embedded memory, and extensive I/O, this device addresses demanding digital designs where integration and predictable supply and thermal envelopes are important.

Key Features

  • Logic Capacity 622,000 logic elements provide substantial programmable logic resources for complex digital designs.
  • Embedded Memory Approximately 51.2 Mbits of on-chip RAM for large buffering, lookup tables, and data storage close to logic.
  • I/O Density 552 I/O pins support high-connectivity designs and extensive external interfacing.
  • Power and Core Supply Specified core voltage range of 870 mV to 930 mV for regulated power planning and supply design.
  • Package & Mounting 1152-BBGA (FCBGA) 35×35 supplier package in a surface-mount form factor for high-density PCB integration.
  • Temperature Grade Commercial operating range of 0°C to 85°C suitable for standard commercial electronics environments.
  • Environmental Compliance RoHS compliant for global manufacturing and regulatory alignment.
  • Stratix V GX Family Part of the Stratix V GX family; the series documentation describes configurable core and transceiver speed grade options at the family level.

Typical Applications

  • High-density programmable logic — Utilize the device’s 622,000 logic elements for complex state machines, pipelined datapaths, and custom accelerators where large logic capacity is required.
  • On-chip buffering and memory-intensive functions — Approximately 51.2 Mbits of embedded RAM enables large FIFOs, caches, and local data storage to minimize external memory dependency.
  • High-pin-count interfacing — 552 I/O pins support systems requiring wide parallel interfaces, multiple high-speed links, or extensive peripheral connectivity.

Unique Advantages

  • Substantial programmable logic: 622,000 logic elements let designers implement complex, high‑parallelism architectures without immediate migration to multi-FPGA systems.
  • Large on-chip memory: Approximately 51.2 Mbits of embedded RAM reduce the need for external memory and lower system latency for data‑intensive functions.
  • Broad I/O support: 552 I/Os enable flexible board-level interfacing and consolidation of multiple signals onto a single device.
  • Controlled core supply range: Defined core voltage between 870 mV and 930 mV simplifies power‑rail planning and component selection.
  • Commercial-ready packaging: 1152-ball FCBGA (35×35) surface-mount package supports compact, high-density PCB layouts for commercial electronics.
  • Regulatory alignment: RoHS compliance supports environmentally responsible manufacturing and global market access.

Why Choose 5SGXEA7H1F35C1?

The 5SGXEA7H1F35C1 combines very large programmable logic resources with substantial embedded memory and high I/O density in a commercial-grade Stratix V GX package. Its well-defined core voltage range and surface-mount FCBGA packaging make it suitable for high-integration, high-capacity designs where minimizing external components and maximizing on-chip resources are priorities.

This part is appropriate for engineering teams developing complex digital systems that require scalable logic, significant on-chip RAM, and abundant external connectivity while operating within standard commercial environmental conditions. The device’s placement within the Stratix V GX family aligns it with the family-level capabilities documented in the series datasheet.

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