5SGXEA5N3F45I4N

The 5SGXEA5N3F45I4N is an industrial-grade Stratix V GX Field Programmable Gate Array (FPGA) from Intel. It offers very-high logic capacity and a large embedded memory complement in a high-density FCBGA package for surface-mount applications.

Designed for systems that require substantial programmable logic, extensive on-chip memory, and a large I/O complement, this device is positioned for demanding industrial and advanced embedded applications where integration and reliability across a wide operating temperature are important.

Key Features

• High Logic Capacity — 490,000 logic elements provide extensive programmable resources for complex FPGA designs.
• Embedded Memory — Approximately 46 Mbits of on-chip RAM to support large data buffering, lookup tables, and state storage.
• Extensive I/O — 840 user I/O pins enable wide interfacing options for high-channel-count systems and mezzanine connectivity.
• Package & Mounting — 1932-BBGA (FCBGA) package, supplier device package 1932-FBGA, FC (45×45); surface-mount placement for PCB assembly.
• Powering — Core supply range from 820 mV to 880 mV to match board-level power delivery and core-voltage constraints.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for use in industrial environments.
• RoHS Compliant — Conforms to RoHS requirements for reduced hazardous substances.

Typical Applications

• High-density signal processing — Large logic and memory resources support complex DSP algorithms and multi-channel processing.
• Networking and communications systems — High I/O count and Stratix V GX series capabilities make the device suitable for switching, packet processing, and protocol handling.
• Industrial automation — Industrial temperature grade and robust packaging support control, motion, and real-time processing applications.
• Instrumentation and test equipment — Significant embedded RAM and logic capacity enable data acquisition, custom processing pipelines, and timing-critical functions.

Unique Advantages

• Large programmable fabric — 490,000 logic elements let you consolidate multiple functions into a single device and reduce external logic.
• Substantial on-chip memory — Approximately 46 Mbits of RAM reduce the need for external memory in many buffering and caching use cases.
• Broad I/O availability — 840 I/Os provide flexibility for dense board-level connectivity and high-channel-count designs.
• Industrial-ready thermal range — −40 °C to 100 °C operating range supports deployments in industrial and ruggedized environments.
• High-density FCBGA package — 1932-ball FCBGA enables compact board layouts while maintaining extensive I/O and logic capacity.
• Controlled core-voltage window — 820 mV–880 mV supply range supports predictable power-budget planning for high-performance FPGA cores.

Why Choose 5SGXEA5N3F45I4N?

The 5SGXEA5N3F45I4N combines high logic density, substantial embedded memory, and a large I/O complement in an industrial-grade Stratix V GX FPGA package. It suits designs that demand consolidated programmable logic, significant on-chip buffering, and broad interfacing without sacrificing operating temperature range or package density.

As part of the Stratix V family, this device is appropriate for engineering teams building advanced communications, signal processing, and industrial systems that require scalable logic resources and robust platform-level characteristics. Its combination of capacity, I/O, and temperature rating offers a practical path to reduce board-level complexity while supporting long-term deployment needs.

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