5SGXEA5N3F45I3LN

The 5SGXEA5N3F45I3LN is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, designed for high-density logic and memory integration in industrial-grade systems. It combines a large logic fabric with substantial on-chip RAM and a high I/O count to support complex, multi-function FPGA designs.

As an industrial-grade device, this Stratix V GX part supports an extended operating temperature range and is supplied in a high-pin-count FCBGA package, providing the physical and electrical characteristics required for demanding embedded and communications applications.

Key Features

• Logic capacity — 490,000 logic elements (LEs) to implement large-scale digital logic and custom hardware acceleration.
• Embedded memory — Approximately 46 Mbits of on-chip RAM for buffering, FIFOs, and on-chip data storage.
• I/O resources — 840 available I/Os to support extensive external interfacing and system connectivity.
• Power supply range — Core voltage specified from 820 mV to 880 mV for defined power planning and regulation.
• Package & mounting — 1932-ball BGA (FCBGA) in a 45 × 45 mm footprint, surface-mount format suitable for compact, high-density PCB layouts.
• Industrial temperature grade — Rated for operation from –40 °C to 100 °C to meet extended-environment requirements.
• Standards compliance — RoHS-compliant construction.
• Stratix V GX series details (datasheet) — Series documentation describes available transceiver speed grades and device operating characteristics for Stratix V GX devices.

Unique Advantages

• High-density integration: 490,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• On-chip memory capacity: Approximately 46 Mbits of embedded RAM provides local storage for data paths and buffering without external memory in many use cases.
• Extensive I/O capability: 840 I/Os support broad peripheral and subsystem connectivity, simplifying system partitioning and board routing.
• Industrial robustness: Rated operation from –40 °C to 100 °C supports deployment in temperature-challenging environments.
• Compact, manufacturable package: 1932-ball FCBGA in a 45 × 45 mm format supports high-density PCBs while maintaining manufacturability via surface-mount assembly.
• Compliance and lifecycle traceability: RoHS compliance and Intel/Altera series documentation back product selection and long-term procurement planning.

Why Choose 5SGXEA5N3F45I3LN?

This Stratix V GX FPGA balances very large logic capacity, significant embedded memory, and a high I/O count in an industrial-grade FCBGA package, making it suitable for designs that require integration of complex logic, on-chip data storage, and broad external connectivity. The specified core voltage range and extended operating temperature support disciplined power and thermal planning for robust system designs.

Engineers selecting 5SGXEA5N3F45I3LN gain a device backed by the Stratix V series documentation and Intel manufacturing, offering a clear specification set for high-density, industrial FPGA applications where scalability and integration matter.

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