5SGXEA5N3F45I3G

The 5SGXEA5N3F45I3G is a Stratix® V GX Field Programmable Gate Array (FPGA) in a 1932-ball FCBGA package, built for high-density programmable logic and complex I/O requirements. It provides 490,000 logic elements, approximately 46 Mbits of embedded memory, and up to 840 I/O pins, making it suitable for designs that require large programmable fabric and high I/O capacity.

Designed and specified for industrial use, this device operates from a core voltage range of 820 mV to 880 mV and across an operating temperature range of -40 °C to 100 °C, delivering deterministic electrical and thermal characteristics for robust deployments.

Key Features

• Core Logic Capacity — 490,000 logic elements (cells) provide extensive programmable fabric for complex algorithms, state machines, and custom accelerators.
• Embedded Memory — Approximately 46 Mbits of on-chip RAM supports large buffering, frame storage, and intermediate data structures without external memory dependence.
• I/O Density — Up to 840 I/O pins accommodate dense connectivity to peripherals, mezzanine modules, or backplane interfaces.
• High-speed Transceiver Family Support — As part of the Stratix V GX family, transceiver options in the series include GX channel support (tabled up to 14.1 Gbps in the series documentation), enabling high-speed serial links where selected.
• Power and Voltage — Core operating range between 820 mV and 880 mV supports low-voltage core operation aligned with Stratix V electrical characteristics.
• Package & Mounting — 1932-ball BGA (FCBGA) package in a 45 × 45 mm footprint; surface-mountable for standard board assembly processes.
• Industrial Grade Temperature — Rated for operation from -40 °C to 100 °C to meet industrial environment requirements.
• Environmental Compliance — RoHS compliant, meeting lead-free environmental requirements for electronics manufacturing.

Typical Applications

• High-density logic and control — Use where large programmable fabric and extensive on-chip memory are required to implement complex control, processing, or protocol logic.
• High-pin-count interfacing — Suitable for systems needing many parallel or differential I/Os, including interface bridging and board-level aggregation.
• Industrial and embedded systems — Industrial-grade temperature rating and robust electrical specs make the device suitable for demanding embedded applications that require long-term reliability.
• High-speed serial links (family-level) — Leverage Stratix V GX family transceiver options for designs that include high-speed serial communications where applicable within the family’s transceiver offerings.

Unique Advantages

• Extensive programmable resources: 490,000 logic elements and ~46 Mbits of embedded RAM reduce reliance on external components and simplify complex system integration.
• High I/O capacity: 840 I/Os enable direct connection to multiple peripherals and dense board-level interfaces, reducing the need for additional I/O expanders.
• Industrial reliability: Rated operation from -40 °C to 100 °C supports deployment in industrial environments with wide temperature swings.
• Compact, assembly-friendly package: 1932-ball FCBGA (45 × 45 mm) provides high-density routing in a standard surface-mount form factor for production assembly.
• RoHS compliant: Meets environmental regulations for lead-free manufacturing processes.
• Family-level high-speed options: Stratix V GX family transceiver options documented up to 14.1 Gbps support designs that require selectable high-speed serial channels within the series.

Why Choose 5SGXEA5N3F45I3G?

The 5SGXEA5N3F45I3G offers a combination of high logic density, substantial embedded memory, and very large I/O capacity in a single industrial-grade FCBGA package. It is positioned for engineers who need scalable programmable fabric and robust electrical/thermal operating characteristics for complex embedded and industrial systems.

Its industrial temperature rating, low-voltage core range, and RoHS compliance make it a practical choice for long-term deployments where reliability, integration density, and adherence to environmental standards are important.

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