5SGXEA5N3F45I3L

The 5SGXEA5N3F45I3L is an Intel Stratix® V GX field-programmable gate array (FPGA) delivered in a 1932‑BBGA FCBGA package for surface-mount assembly. It provides high integration density with a large logic element count, substantial embedded RAM, and ample I/O to support complex digital systems.

Targeted for industrial-grade applications, the device combines Stratix V GX family capabilities — including high-speed transceiver class behavior at the series level — with a wide operating temperature range and RoHS compliance to meet demanding system requirements.

Key Features

• High logic density — Approximately 490,000 logic elements (logic cells) for implementing large, complex designs and heavy combinational/sequential logic.
• Embedded memory — Approximately 46 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive processing without external memory for many functions.
• Extensive I/O — 840 user I/Os to enable wide parallel interfaces, multi-channel connectivity, and dense board-level integration.
• Transceiver capability (family-level) — Stratix V GX family transceiver speed grades are defined in the device datasheet, with GX channel listings up to 14.1 Gbps for applicable speed grades at the family level.
• Low-voltage core — Core voltage supply range 0.82–0.88 V to match system power-rail constraints and enable controlled power design.
• Industrial temperature grade — Rated for operation from −40 °C to 100 °C for use in industrial environments.
• Robust package and mounting — 1932‑BBGA (FCBGA) package; supplier device package listed as 1932‑FBGA, FC (45×45); surface-mount mounting for standard PCB assembly.
• Regulatory status — RoHS compliant.

Typical Applications

• High-speed serial communications — Leverages the Stratix V GX family transceiver characteristics to implement multi-gigabit links and protocol bridging where high-speed channels are required.
• High-density logic integration — Implements complex control, signal-processing, or protocol logic using the device’s approximately 490,000 logic elements and on-chip memory.
• I/O-intensive systems — Supports boards and modules that require large numbers of parallel or multiplexed I/Os, thanks to 840 available user I/Os.
• Industrial control and instrumentation — Industrial-grade temperature rating and robust packaging make the device suitable for rugged embedded systems and instrumentation applications.

Unique Advantages

• High integration density: Large logic element count reduces the need for multiple devices and simplifies system partitioning.
• On-chip memory capacity: Approximately 46 Mbits of embedded RAM supports large buffers and local storage, which can reduce external memory dependency.
• Wide I/O complement: 840 I/Os enable broad connectivity options for multi-interface designs and high‑pin-count requirements.
• Industrial readiness: Specified operating range from −40 °C to 100 °C and industrial grade help ensure reliable operation in demanding environments.
• Package flexibility: 1932‑BBGA (FCBGA) surface-mount package and the supplier’s 1932‑FBGA, FC (45×45) form factor support compact, high-density PCB layouts.
• Series-level transceiver capability: Stratix V GX family transceiver grades are documented in the datasheet for multi-gigabit channel applications.

Why Choose 5SGXEA5N3F45I3L?

The 5SGXEA5N3F45I3L combines substantial logic resources, abundant on-chip RAM, and a large I/O count in a single industrial-grade Stratix V GX FPGA package. These attributes make it well suited to complex digital systems that require consolidation of logic, memory, and I/O into a compact board footprint while operating across a wide temperature range.

Engineers designing industrial networking, high-speed communication interfaces, or dense signal-processing subsystems will find the device’s integration level and series-level transceiver characteristics advantageous for reducing BOM complexity and enabling scalable, robust designs.

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