5SGXEA7H1F35C2

The 5SGXEA7H1F35C2 is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, offered in a 1152-ball FCBGA package (35 × 35 mm). This commercial-grade device provides a large programmable fabric and significant on-chip memory for complex digital designs.

Key on-device resources include 622,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 552 I/O pins. The device operates from a core voltage supply range of 870 mV to 930 mV and is specified for commercial operating temperatures from 0 °C to 85 °C.

Key Features

• Family and Architecture  Part of the Stratix V GX family of FPGAs, delivering a programmable fabric suitable for high-density designs.
• Logic Capacity  622,000 logic elements to implement large-scale digital functions and custom accelerators.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and data-intensive processing.
• I/O Count  552 I/O pins to support wide parallel interfaces and dense peripheral connectivity.
• Power  Core supply voltage specified from 870 mV to 930 mV.
• Package & Mounting  1152-ball FCBGA (1152-FBGA, 35 × 35 mm) package; surface-mount device for PCB assembly.
• Temperature Grade  Commercial grade with an operating range of 0 °C to 85 °C.
• Compliance  RoHS-compliant for environmental and regulatory consistency.

Unique Advantages

• Large programmable fabric: 622,000 logic elements enable implementation of complex state machines, datapaths, and custom processing pipelines.
• Substantial on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces external memory dependence for many buffering and caching needs.
• High I/O density: 552 I/Os support broad interfacing options for high-throughput and multi-channel systems.
• Compact FCBGA footprint: 1152-ball FCBGA (35 × 35 mm) balances board-level density with solderability for surface-mount assembly.
• Commercial operating range: Rated 0 °C to 85 °C for standard commercial applications and environments.
• Regulatory alignment: RoHS compliance supports environmentally conscious product development.

Why Choose 5SGXEA7H1F35C2?

The 5SGXEA7H1F35C2 combines a large logic fabric, plentiful embedded memory, and a high I/O count in a compact FCBGA package, making it well-suited for advanced commercial FPGA designs that require significant on-chip resources. Its specification for core voltage and operating temperature provides clear integration parameters for system power and thermal planning.

This device is targeted for development teams and OEMs designing complex digital systems that need scalable programmable logic, substantial internal RAM, and dense external connectivity while staying within commercial temperature and voltage envelopes.

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