5SGXEA7H1F35C2LN

The 5SGXEA7H1F35C2LN is an Intel Stratix V GX Field Programmable Gate Array (FPGA) supplied in a 1152‑BBGA FCBGA surface‑mount package. It delivers high logic and memory capacity for demanding commercial‑grade digital designs.

Key on‑chip resources include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 552 user I/Os. The device operates from a core supply of 820 mV to 880 mV and is specified for commercial temperature operation from 0 °C to 85 °C.

Key Features

• Core Logic Capacity — 622,000 logic elements to support large, complex programmable logic implementations.
• Embedded Memory — Approximately 51.2 Mbits of on‑chip RAM for buffering, LUTRAM, and data storage needs.
• I/O Count — 552 user I/O pins for dense connectivity to peripherals, high‑speed interfaces, and board-level routing.
• Package & Mounting — 1152‑BBGA (FCBGA) surface‑mount package; supplier package noted as 1152‑FBGA (35×35).
• Power — Core supply operating range 820 mV to 880 mV, suitable for regulated core power domains.
• Temperature & Grade — Commercial grade device specified for 0 °C to 85 °C operation.
• Environmental Compliance — RoHS compliant.

Unique Advantages

• High logic density: 622,000 logic elements enable consolidation of large logic functions within a single device.
• Substantial embedded memory: Approximately 51.2 Mbits of on‑chip RAM reduces dependence on external memory for many applications.
• Extensive I/O resources: 552 I/Os provide flexibility for multi‑lane interfaces and broad peripheral connectivity.
• Compact, high‑pin package: 1152‑BBGA FCBGA packaging delivers a high pin count in a surface‑mount form factor suitable for dense board layouts.
• Commercial temperature rating: Rated 0 °C to 85 °C for standard commercial environments and deployments.
• Regulatory compliance: RoHS status ensures adherence to common environmental material restrictions.

Why Choose 5SGXEA7H1F35C2LN?

This Intel Stratix V GX FPGA combines very large logic capacity, significant embedded memory, and a high I/O count in a compact 1152‑BBGA package. It is positioned for commercial designs that require substantial on‑chip resources and dense board connectivity while operating within standard commercial temperature and core‑voltage envelopes.

For engineering and procurement teams pursuing high‑capacity programmable logic with clearly specified electrical, thermal, and packaging attributes, the 5SGXEA7H1F35C2LN offers a verifiable, RoHS‑compliant option from a recognized FPGA family.

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