5SGXEA7H1F35I2G

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 51200000 622000 1152-BBGA, FCBGA

Quantity 697 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7H1F35I2G – Stratix® V GX Field Programmable Gate Array (FPGA)

The 5SGXEA7H1F35I2G is a Stratix V GX family FPGA in an industrial-grade package, delivering large logic capacity, substantial embedded memory, and a high I/O count for complex digital designs. Built on the Stratix V GX architecture, it targets designs that require extensive programmable logic, abundant on-chip RAM, and robust I/O and transceiver capabilities as defined for the family.

Key Features

  • Core logic  622,000 logic elements provide extensive programmable logic resources for complex system implementations.
  • Embedded memory  Approximately 51.2 Mbits of on-chip RAM to support large buffering, state storage, and memory-intensive functions.
  • I/O and package  552 user I/O pins in a 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35), surface-mount mounting.
  • Power supply  Core voltage supply specified from 870 mV to 930 mV for defined operating conditions.
  • Thermal and grade  Industrial temperature grade with an operating temperature range of −40 °C to 100 °C.
  • Stratix V GX transceiver family characteristics  The Stratix V GX family includes transceiver speed grades (series-level information) such as GX channel rates documented up to 14.1 Gbps, enabling high-speed serial interfaces where applicable to the family.
  • Regulatory status  RoHS compliant.

Typical Applications

  • High-density logic systems  Designs requiring hundreds of thousands of logic elements and large embedded memory arrays can leverage the device’s capacity for complex FPGA implementations.
  • High-port-count I/O designs  Applications that need a large number of general-purpose I/O signals benefit from the device’s 552 I/O pins and high-pin-count FBGA package.
  • Industrial electronics  Industrial-grade temperature range (−40 °C to 100 °C) supports deployment in temperature-demanding environments.
  • High-speed serial interfaces (family-level)  Where Stratix V GX family transceiver options are applicable, the documented transceiver speed grades provide options for high-speed serial link designs.

Unique Advantages

  • High logic capacity: 622,000 logic elements reduce the need to partition designs across multiple devices.
  • Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM supports large buffers and local data storage, simplifying external memory requirements.
  • Large I/O complement in a compact package: 552 I/Os in a 1152-FBGA (35×35) package allow dense routing and high signal integration on modern PCBs.
  • Industrial operation range: Rated for −40 °C to 100 °C, suitable for industrial systems that require extended temperature tolerance.
  • Defined core supply range: Core voltage specification (870 mV to 930 mV) enables precise power-rail design and predictable device operation.
  • RoHS compliance: Meets lead-free and restricted-substance requirements for a wide range of markets.

Why Choose 5SGXEA7H1F35I2G?

The 5SGXEA7H1F35I2G combines a high count of logic elements and substantial embedded memory with a large I/O complement in an industrial-grade FCBGA package, positioning it for complex, high-density FPGA applications. Its documented family-level transceiver capabilities and defined electrical/thermal specifications make it suitable for teams that need predictable integration of logic, memory, and I/O in a single device.

This device is well suited to engineering teams and procurement groups building systems that prioritize scalability of logic resources, on-chip memory capacity, and robust operation across industrial temperature ranges, while maintaining compliance with RoHS requirements.

Request a quote or submit a pricing and availability inquiry today to evaluate 5SGXEA7H1F35I2G for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up