5SGXEA7H1F35I2

The 5SGXEA7H1F35I2 is a Stratix® V GX field programmable gate array (FPGA) manufactured by Intel. It provides a large logic fabric and substantial embedded memory in a high‑pin‑count FCBGA package for designs that require significant on‑chip resources and extensive I/O connectivity.

Built for industrial temperature operation and low‑voltage core supply, this device is suited to applications demanding high resource density, wide I/O capability, and robust thermal range.

Key Features

• Logic Capacity — 622,000 logic elements, enabling complex digital designs and large, multi‑function implementations.
• Embedded Memory — Approximately 51.2 Mbits of on‑chip RAM for data buffering, FIFOs, and on‑chip storage.
• I/O Resources — 552 user I/O pins to support wide parallel interfaces, multiple peripherals, and high fan‑out systems.
• Package and Mounting — 1152‑BBGA FCBGA (1152‑FBGA, 35×35) surface‑mount package for dense board integration.
• Power Supply — Core supply range of 870 mV to 930 mV to match system power rails and low‑voltage architectures.
• Temperature Range — Industrial grade operation from −40 °C to 100 °C for deployment in demanding environments.
• Regulatory — RoHS compliant.

Typical Applications

• High‑density programmable logic — Implement large custom logic blocks and complex state machines using 622,000 logic elements.
• I/O‑intensive systems — Support wide parallel buses, multiple interfaces, and dense connector systems with 552 I/O pins.
• Industrial embedded systems — Suitable for industrial environments requiring operation from −40 °C to 100 °C and surface‑mount packaging.
• On‑chip data buffering and processing — Leverage approximately 51.2 Mbits of embedded RAM for local storage, buffering, and streaming data paths.

Unique Advantages

• High logic density: 622,000 logic elements provide headroom for consolidation of multiple functions into a single device, reducing board count.
• Substantial embedded memory: Approximately 51.2 Mbits of RAM enables on‑chip data handling and minimizes reliance on external memory for many use cases.
• Extensive I/O connectivity: 552 I/O pins support complex interfacing and system expansion without additional multiplexing hardware.
• Industrial temperature capability: Rated for −40 °C to 100 °C, making the device appropriate for thermally demanding installations.
• Compact, high‑pin package: 1152‑FBGA (35×35) surface‑mount package delivers high pin count in a board‑efficient form factor.
• Low‑voltage core operation: Core supply between 870 mV and 930 mV supports integration with modern low‑voltage power domains.

Why Choose 5SGXEA7H1F35I2?

The 5SGXEA7H1F35I2 combines large programmable logic capacity, significant on‑chip memory, and broad I/O resources in a single industrial‑grade Stratix V GX FPGA package. These hardware characteristics make it a strong option for engineers consolidating complex digital functions and high‑bandwidth interfaces into a compact board footprint.

As part of the Stratix V device family from Intel, this device is accompanied by family documentation and electrical specifications suitable for detailed system design and qualification, supporting long‑term deployment and iterative development cycles.

Request a quote or submit your inquiry to begin integrating the 5SGXEA7H1F35I2 into your next design. Our team can provide pricing, availability, and additional product documentation on request.