5SGXEA7H1F35I2N

The 5SGXEA7H1F35I2N is a Stratix V GX field programmable gate array (FPGA) IC in a 1152-BBGA (35×35) FCBGA package. It delivers a high logic capacity and substantial on‑chip memory, combined with a large I/O count and industrial operating range for demanding embedded and system-level applications.

Designed for applications that require dense programmable logic, wide connectivity and robust thermal performance, this device provides 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 552 user I/Os while operating from a 0.870–0.930 V core supply.

Key Features

• Core Logic  622,000 logic elements provide extensive programmable fabric for complex digital designs and custom accelerators.
• Embedded Memory  Approximately 51.2 Mbits of on‑chip RAM to support large buffering, lookup tables and state storage without external memory.
• I/O Capacity  552 user I/Os for broad interfacing options with peripherals, memory, and multi‑lane systems.
• Power and Voltage  Core voltage supply range of 870 mV to 930 mV to match low‑voltage system domains.
• Package and Mounting  1152‑BBGA (supplier package: 1152‑FBGA, 35×35) FCBGA surface‑mount package for high‑density board integration.
• Temperature and Grade  Industrial temperature grade with operating range of −40 °C to 100 °C for reliable operation in extended temperature environments.
• RoHS Compliant  Manufactured to RoHS standards for environmental compliance.

Typical Applications

• High‑performance networking  Use the large logic array and extensive I/O count for packet processing, switching fabric, and protocol handling.
• Data acceleration and compute  Implement custom accelerators and pipelines using the dense logic and on‑chip RAM for low‑latency processing.
• Industrial control and automation  Industrial temperature rating and robust I/O make this FPGA suitable for motor control, PLCs, and factory automation systems.
• Telecom infrastructure  Leverage the device’s capacity and I/O to build line cards, PHY interfaces, and protocol bridges in communications equipment.

Unique Advantages

• High logic density: 622,000 logic elements enable consolidation of multiple functions and complex state machines into a single device, reducing board count.
• Substantial embedded memory: Approximately 51.2 Mbits of on‑chip RAM supports deep buffering and local data storage, minimizing dependence on external memory.
• Generous I/O resources: 552 I/Os provide flexibility to connect high‑pin‑count peripherals and multi‑lane interfaces without extensive multiplexing.
• Industrial temperature range: Rated from −40 °C to 100 °C to maintain functionality across harsh and variable environmental conditions.
• Compact, high‑density package: The 1152‑BBGA FCBGA (35×35) package supports high‑pin integration in space‑constrained boards.
• Low‑voltage core support: Core supply between 870 mV and 930 mV aligns with modern low‑voltage design domains.

Why Choose 5SGXEA7H1F35I2N?

The 5SGXEA7H1F35I2N positions itself as a high‑capacity Stratix V GX FPGA option for designs that demand large programmable logic, abundant on‑chip memory and extensive I/O within an industrial temperature envelope. Its combination of 622,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 552 I/Os supports system consolidation and flexible interface integration.

Engineers and system designers targeting network, compute, telecom or industrial applications benefit from the device’s logic and memory resources, compact 1152‑BBGA package, and documented Stratix V family electrical characteristics. The device is suitable for projects that require scalable logic capacity and ruggedized operating conditions.

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