5SGXEA7H2F35C1WN

The 5SGXEA7H2F35C1WN is a Stratix® V GX Field Programmable Gate Array (FPGA) in a 1152-BBGA FCBGA package, offered by Intel. It provides a high-capacity programmable logic fabric with a large embedded memory complement and extensive I/O for complex system integration.

Targeted at designs that require very large logic capacity, substantial on-chip RAM, and high I/O counts, this commercial‑grade device supports designs operating within a core supply range of 0.87–0.93 V and an ambient temperature range of 0 °C to 85 °C.

Key Features

• High logic capacity — 622,000 logic elements (cells) to implement large-scale digital logic and custom compute functions.
• Substantial embedded memory — approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• Extensive I/O — 552 user I/O pins to support multiple interfaces and wide parallel buses.
• Package and mounting — 1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA (35×35); surface-mountable for board-level integration.
• Power — core voltage supply range of 870 mV to 930 mV to match system power architectures.
• Commercial temperature grade — rated for 0 °C to 85 °C operation for standard commercial applications.
• RoHS compliant — meets RoHS environmental requirements for lead-free manufacturing.

Typical Applications

• High-density programmable logic systems — implement large custom logic blocks and complex control systems using the device’s 622,000 logic elements.
• Memory-intensive designs — leverage approximately 51.2 Mbits of embedded RAM for on-chip buffering, packet processing, and local data storage.
• Board-level I/O aggregation — use the 552 user I/O pins to connect multiple high-speed peripherals and parallel interfaces.

Unique Advantages

• Large programmable fabric: 622,000 logic elements enable substantial integration of logic functions on a single device, reducing external component count.
• Significant on-chip memory: approximately 51.2 Mbits of embedded RAM helps minimize external memory requirements and improves data locality.
• High I/O density: 552 I/O pins provide flexibility for wide buses, multi-lane interfaces, and dense board designs.
• Compact, system-ready package: 1152-BBGA / 1152-FBGA (35×35) FCBGA packaging supports high-density PCB assembly and reliable surface-mount integration.
• Controlled core power: a defined voltage supply window (0.87–0.93 V) helps system designers plan power delivery and thermal solutions.
• Commercial-grade operating range: rated for 0 °C to 85 °C to match standard commercial product environments.

Why Choose 5SGXEA7H2F35C1WN?

The 5SGXEA7H2F35C1WN pairs very large programmable logic capacity with substantial embedded memory and a high I/O complement in a single, surface‑mount FCBGA package. Its combination of 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 552 user I/O makes it well suited for designs that consolidate complex logic, buffering, and dense interfacing onto a single FPGA.

As a commercial‑grade Stratix V GX device, it fits projects that require high integration density and a defined operating envelope. The device’s RoHS compliance and standardized package options simplify assembly and regulatory planning while enabling scalable development within the Stratix V family.

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