5SGXEA7H2F35C2L

The 5SGXEA7H2F35C2L is a Stratix V GX Field Programmable Gate Array (FPGA) from Intel, supplied in a 1152‑BBGA (35×35) FCBGA package. It provides a high on‑chip resource set—622,000 logic elements and approximately 51.2 Mbits of embedded memory—combined with a large I/O count to address complex digital designs.

Designed for commercial‑grade applications, this device targets systems that require substantial logic capacity, large embedded RAM, and broad I/O integration within a surface‑mount FCBGA footprint.

Key Features

• Core Logic 622,000 logic elements (cells) for implementing large-scale digital logic and custom architectures.
• Embedded Memory Approximately 51.2 Mbits of on‑chip RAM to support buffering, lookup tables, and memory‑intensive algorithms.
• I/O Capacity 552 user I/O pins to accommodate high I/O‑count interfaces and multi‑lane connectivity.
• Package 1152‑BBGA, FCBGA package (supplier device package: 1152‑FBGA 35×35) for robust surface‑mount integration.
• Supply Voltage Core operating supply range: 820 mV to 880 mV.
• Operating Temperature Commercial temperature grade: 0 °C to 85 °C.
• Series‑Level Transceiver Capabilities (Series Data) Stratix V GX family transceiver speed grades are documented in the device datasheet; GX channel grades in the series include options up to 14.1 Gbps (series specification).
• Compliance RoHS‑compliant.

Typical Applications

• High‑density digital systems Use the large logic element count and embedded memory to implement complex custom accelerators and state machines.
• Multi‑I/O interface hubs 552 I/O pins enable integration of numerous parallel interfaces, buses, and peripherals within a single device.
• Memory‑intensive processing Approximately 51.2 Mbits of embedded RAM supports buffering, packet processing, and on‑chip data storage needs.
• Transceiver‑enabled systems (series capability) For designs leveraging the Stratix V GX family transceivers, the series datasheet documents high‑speed channel grades for transceiver‑centric applications.

Unique Advantages

• High logic density: 622,000 logic elements allow extensive logic integration without partitioning across multiple devices.
• Substantial on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduces external memory dependence and simplifies board design.
• Large I/O complement: 552 I/Os provide flexibility for multi‑lane interfaces, parallel buses, and mixed I/O configurations.
• Compact, manufacturable package: 1152‑BBGA (35×35) FCBGA package supports surface‑mount assembly for production volumes.
• Commercial temperature rating: Specified 0 °C to 85 °C operation for general commercial applications.
• Standards‑friendly supply range: Core voltage range of 820 mV to 880 mV matches documented Stratix V operating conditions.

Why Choose 5SGXEA7H2F35C2L?

The 5SGXEA7H2F35C2L positions itself as a high‑capacity Stratix V GX FPGA option for engineers who require a combination of extensive logic resources, significant on‑chip memory, and a high I/O count in a production‑ready FCBGA package. Its commercial temperature grade and documented supply range make it suitable for demanding digital and connectivity‑focused designs.

Backed by Intel’s Stratix V family documentation, this device is appropriate for designs that demand scalable logic and memory resources while benefiting from the series’ transceiver capabilities as specified in the device datasheet.

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