5SGXEA7H2F35C2W

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 51200000 622000 1152-BBGA, FCBGA

Quantity 903 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7H2F35C2W – Stratix® V GX Field Programmable Gate Array (FPGA) IC

The 5SGXEA7H2F35C2W is a Stratix V GX family field programmable gate array (FPGA) in a 1152-ball FCBGA package. It delivers high on-chip logic density, large embedded memory, and a broad I/O complement for demanding system designs.

Designed for commercial-temperature applications, this device combines 622,000 logic elements with approximately 51.2 Mbits of embedded memory and dedicated high-speed transceiver capability (per the Stratix V GX device datasheet), making it suitable for high-performance communications and complex signal-processing tasks.

Key Features

  • Core Logic  622,000 logic elements provide substantial programmable fabric for complex designs and IP integration.
  • Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive algorithms.
  • I/O and Transceivers  552 I/O pins for wide external connectivity; Stratix V GX transceiver speed grades are listed in the family datasheet (including GX channel rates such as 14.1 Gbps, 12.5 Gbps and 8.5 Gbps in specified speed grades).
  • Power  Tight core supply range of 870 mV to 930 mV supports predictable power budgeting and voltage planning.
  • Package & Mounting  1152-ball BGA (1152-FBGA, 35×35) surface-mount package (FCBGA) for compact board-level integration.
  • Operating Conditions  Commercial temperature grade: 0 °C to 85 °C, suitable for a wide range of controlled-environment applications.
  • Compliance  RoHS-compliant construction supports modern regulatory requirements for electronic assemblies.

Typical Applications

  • High‑speed communications  Uses the Stratix V GX transceiver capability and abundant I/O to implement multi‑lane serial links and protocol bridging.
  • Signal processing and acceleration  Large logic capacity and significant on‑chip RAM support DSP pipelines, packet processing, and custom acceleration engines.
  • System integration and prototyping  High I/O count and a dense FCBGA package allow integration of complex interfaces and rapid hardware prototyping.

Unique Advantages

  • High programmable density: 622,000 logic elements enable complex, multi‑function designs without immediate need for external logic.
  • Substantial embedded memory: Approximately 51.2 Mbits of on‑chip RAM reduce dependence on external memory for buffering and state storage.
  • Broad external connectivity: 552 I/Os provide flexible interfacing options for high-pin-count systems and mixed-signal front ends.
  • High-speed serial support: Stratix V GX family transceiver speed grades (as documented in the device datasheet) support implementation of high-throughput serial links.
  • Compact board footprint: 1152-ball FCBGA package delivers dense integration for space-constrained PCBs.
  • RoHS-compliant: Supports current lead-free and environmental requirements for commercial electronic products.

Why Choose 5SGXEA7H2F35C2W?

The 5SGXEA7H2F35C2W positions itself as a high‑capacity, commercially graded Stratix V GX FPGA for applications that demand large programmable fabric, significant embedded memory, and substantial I/O. Its documented transceiver speed grades and high I/O count make it well suited to communications, signal processing, and system‑level integration projects where on‑chip resources and high throughput are priorities.

With a compact 1152-ball FCBGA package, defined core voltage range, and commercial operating temperature rating, this device offers a predictable platform for development cycles and production designs within controlled-environment markets.

Request a quote or submit a pricing inquiry to receive availability and purchasing information for the 5SGXEA7H2F35C2W.

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