5SGXEA7H2F35C3G

The 5SGXEA7H2F35C3G is a Stratix® V GX field programmable gate array (FPGA) offered in a 1152-BBGA FCBGA package for surface-mount applications. It delivers high logic capacity and on-chip memory in a commercial-temperature-grade device suitable for designs that require large-scale programmable logic and substantial embedded RAM.

With 622,000 logic elements, approximately 51.2 Mbits of embedded memory and 552 I/O pins, this device targets applications that need dense logic integration, extensive data buffering, and flexible I/O connectivity while operating within a core voltage range of 820 mV to 880 mV and an ambient temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  622,000 logic elements (logic cells) to support large, complex designs and high integration of custom logic functions.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for packet buffering, frame storage, and on‑chip data working sets.
• I/O Count  552 I/O pins providing broad external connectivity options for parallel interfaces, control signals, and multi-channel I/O.
• Power and Core Voltage  Rated supply voltage range from 820 mV to 880 mV for core operation.
• Package & Mounting  1152‑BBGA (35×35) FCBGA package in a surface-mount form factor for board-level integration.
• Operating Grade & Temperature  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards Compliance  RoHS compliant, indicating adherence to published restrictions on hazardous substances.

Typical Applications

• High-density custom logic  Use the device to implement large-scale programmable logic functions where hundreds of thousands of logic elements are required.
• Data buffering and packet processing  Approximately 51.2 Mbits of embedded RAM supports on-chip buffering, FIFOs, and local packet storage for networking or streaming data paths.
• Multi-channel I/O systems  With 552 I/O pins, deploy the FPGA as a central I/O aggregator for systems requiring many parallel interfaces or mixed signaling domains.

Unique Advantages

• High logic density: 622,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Significant on-chip memory: Approximately 51.2 Mbits of RAM reduces dependence on external memory for many buffering and streaming use cases.
• Extensive I/O capability: 552 I/O pins provide flexibility for diverse interface requirements and system-level partitioning.
• Commercial-grade operation: Designed for a 0 °C to 85 °C operating range to meet typical commercial environmental conditions.
• Compact surface-mount package: 1152‑BBGA (35×35) FCBGA packaging simplifies placement in dense board layouts while supporting high pin counts.
• Regulatory compliance: RoHS compliance supports assembly processes aligned with hazardous substance restrictions.

Why Choose 5SGXEA7H2F35C3G?

The 5SGXEA7H2F35C3G combines very large logic capacity, substantial embedded RAM, and a high I/O count in a commercial-temperature Stratix V GX device. It is suited to designs that require on-chip integration of complex logic, significant buffering, and broad external connectivity within a surface-mount BBGA footprint.

For engineering teams designing high‑integration systems, this device offers a balance of density, memory, and I/O that supports consolidation of multiple functions onto a single FPGA, simplifying board design and component sourcing while operating within defined commercial temperature and core-voltage ranges.

Request a quote or submit an inquiry to evaluate 5SGXEA7H2F35C3G for your next design and to obtain availability and pricing information.