5SGXEA7H2F35C3WN

IC FPGA 552 I/O 1152FBGA
Part Description

Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 51200000 622000 1152-BBGA, FCBGA

Quantity 1,775 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1152-FBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O552Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs234720Number of Logic Elements/Cells622000
Number of GatesN/AECCNOBSOLETEHTS CodeN/A
QualificationN/ATotal RAM Bits51200000

Overview of 5SGXEA7H2F35C3WN – Stratix® V GX FPGA, 1152‑BBGA FCBGA

The 5SGXEA7H2F35C3WN is an Intel Stratix® V GX field‑programmable gate array (FPGA) in a 1152‑ball BGA package intended for commercial applications. It provides a high logic‑density FPGA fabric with a large on‑chip RAM budget and extensive I/O to support complex, programmable hardware designs.

Designed for high‑density integration, the device combines 622,000 logic elements with approximately 51.2 Mbits of embedded memory and 552 I/O pins, making it suitable for demanding applications that require substantial programmable logic, memory resources, and I/O connectivity. The Stratix V GX family includes defined transceiver speed grades and related electrical characteristics in the device datasheet.

Key Features

  • Logic Density – 622,000 logic elements; 234,720 LABs support large, complex designs and deep logic pipelines.
  • Embedded Memory – Approximately 51.2 Mbits of on‑chip RAM for buffering, FIFOs, and local storage to accelerate dataflow and staged processing.
  • I/O Capacity – 552 I/O pins for broad peripheral and bus connectivity, enabling multi‑interface system integration.
  • Package & Mounting – 1152‑BBGA (FCBGA) supplier package 1152‑FBGA (35×35); surface‑mount device for compact board implementations.
  • Power – Core supply range specified at 820 mV to 880 mV to match Stratix V core voltage requirements.
  • Commercial Temperature Grade – Rated for 0 °C to 85 °C operation for commercial deployment.
  • Standards & Compliance – RoHS‑compliant manufacturing status.
  • Documented Transceiver Options – The Stratix V GX family datasheet documents available transceiver speed grades and related electrical/switching characteristics for designs requiring serial connectivity.

Typical Applications

  • High‑density custom logic and hardware acceleration – Large logic element count and substantial on‑chip RAM let designers implement compute‑intensive algorithms and custom accelerators directly in FPGA fabric.
  • Multi‑interface systems and protocol bridging – 552 I/Os enable consolidation of multiple interfaces and sensors onto a single programmable device for system integration and board‑level consolidation.
  • High‑bandwidth data buffering and packet processing – The combination of embedded RAM and dense logic is suitable for buffering, packet handling, and streaming datapaths.

Unique Advantages

  • Substantial programmable fabric: 622,000 logic elements provide the headroom to implement large state machines, datapaths, and custom processors without partitioning across multiple devices.
  • Large on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for intermediate buffering and low‑latency storage.
  • High I/O count: 552 I/Os simplify board design by enabling direct connections to numerous peripherals, interfaces, and mezzanine modules.
  • Commercial‑grade operation: Specified 0 °C to 85 °C operating range aligns with standard commercial deployments and environments.
  • Compact BGA package: 1152‑ball FCBGA (35×35) provides a high‑density, surface‑mount solution for space‑constrained PCBs.
  • Standards‑documented performance: Electrical and switching characteristics, including transceiver speed grades for the Stratix V GX family, are defined in the device datasheet for engineering validation.

Why Choose 5SGXEA7H2F35C3WN?

This Stratix® V GX device is positioned for designs that require sizable programmable logic capacity, substantial on‑chip memory, and wide I/O resources in a commercial‑grade FPGA. Its combination of logic elements, embedded RAM, and a high I/O count enables integration of complex algorithms and multi‑interface systems into a single device, reducing board complexity and BOM count.

Engineers targeting scalable, high‑density FPGA solutions will find the 5SGXEA7H2F35C3WN suitable for applications where programmable performance, integration, and documented electrical characteristics are priorities. Refer to the manufacturer datasheet for detailed electrical, switching, and transceiver grade specifications to validate against system requirements.

Request a quote or submit your design requirements to receive pricing and availability for the 5SGXEA7H2F35C3WN.

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