5SGXEA7H2F35I2L

The 5SGXEA7H2F35I2L is an Intel Stratix® V GX field programmable gate array (FPGA) supplied in a 1152-ball FBGA package. It delivers a high logic capacity and substantial on-chip memory, together with a large I/O count and industrial temperature rating for demanding, I/O-rich designs.

With 622,000 logic elements and approximately 51.2 Mbits of embedded memory, this device is intended for applications that require significant digital integration, extensive interfacing, and operation across an industrial temperature range.

Key Features

• Logic Capacity — 622,000 logic elements provide substantial programmable logic resources for large or complex designs.
• Embedded Memory — Approximately 51.2 Mbits of on-chip RAM for buffer, cache, and algorithm acceleration needs.
• I/O Density — 552 user I/O pins to support high channel counts and extensive peripheral interfacing.
• Transceiver Family (Series-level) — Part of the Stratix V GX family; series documentation lists GX transceiver speed grades (series-level information included in the device datasheet).
• Power Supply — Core supply range defined between 820 mV and 880 mV for the device core.
• Package & Mounting — 1152-ball FBGA (35 × 35 mm) in a surface-mount package suitable for dense PCB layouts.
• Industrial Temperature Grade — Rated for operation from –40 °C to 100 °C, supporting deployment in industrial environments.
• RoHS Compliant — Meets RoHS requirements for lead-free manufacturing and environmental compliance.

Typical Applications

• High-density digital systems — Large logic resource and on-chip RAM enable complex protocol stacks, data processing pipelines, and custom accelerators.
• Telecom and networking equipment — High I/O count and Stratix V GX series transceiver capability (series-level) support multi-channel interfacing and high-speed serial links.
• Industrial control and automation — Industrial temperature rating and robust packaging suit systems that require continuous operation across extended temperature ranges.
• Test and measurement — Large logic and memory resources accommodate signal processing, data capture, and custom analysis functions.

Unique Advantages

• High integration density: 622,000 logic elements and substantial embedded RAM reduce the need for external logic and memory components.
• Extensive interfacing capability: 552 I/Os enable direct connection to numerous peripherals, sensors, and high-channel-count systems.
• Industrial-grade operation: –40 °C to 100 °C operating range supports deployment in harsher environments and industrial applications.
• Compact, production-ready package: 1152-ball FBGA (35 × 35 mm) surface-mount package facilitates dense PCB integration and volume assembly.
• Controlled core supply range: Defined 820 mV–880 mV voltage supply range supports predictable power planning and thermal management.
• Standards-conscious manufacturing: RoHS-compliant construction aligns with lead-free assembly and environmental requirements.

Why Choose 5SGXEA7H2F35I2L?

The 5SGXEA7H2F35I2L combines high logic capacity, substantial embedded memory, and a large I/O complement in a rugged industrial-temperature FBGA package, making it appropriate for engineers building complex, I/O-heavy systems. Its defined core voltage range and RoHS compliance simplify power budgeting and manufacturing planning.

This part is suited to teams that require significant on-chip resources and reliable operation across wide temperatures—ideal for industrial automation, networking equipment, test systems, and other designs where logic density and interface count are primary requirements.

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