5SGXEA7H2F35I3

The 5SGXEA7H2F35I3 is an Intel Stratix V GX high-density FPGA in a 1152-BBGA FCBGA (35×35) package. It combines a large logic fabric with substantial embedded RAM and a high I/O count to address demanding industrial applications.

Key characteristics include 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM, 552 I/Os, an industrial operating temperature range, and a low-voltage core supply. These attributes make the device suitable for complex, high-integration digital designs requiring robust thermal and voltage operating windows.

Key Features

• Core / Logic — 622,000 logic elements (cells) to implement large-scale digital designs and complex control logic.
• Embedded Memory — Approximately 51.2 Mbits of total on-chip RAM for buffering, FIFOs, and memory-intensive algorithms.
• I/O Capacity — 552 general-purpose I/O pins to support wide parallel interfaces, multi-channel systems, and dense board-level connectivity.
• Power — Core voltage supply range of 820 mV to 880 mV, enabling low-voltage operation consistent with modern FPGA cores.
• Package & Mounting — 1152-FBGA (35×35) package, surface-mount, optimized for compact board layouts with high pin density.
• Operating Range — Industrial temperature grade with an operating range from −40 °C to 100 °C for deployment in harsh environments.
• Environmental Compliance — RoHS compliant for regulatory and manufacturing compatibility.

Typical Applications

• Industrial Control and Automation — Implement high-channel IO, custom control logic, and memory-rich state machines for factory and process automation equipment.
• High-Density Digital Signal Processing — Support complex signal pipelines and buffering using abundant logic resources and on-chip RAM.
• Network and Communications Infrastructure — Provide flexible protocol handling and parallel I/O interfacing for networking equipment and backplane systems.

Unique Advantages

• High logic capacity: 622,000 logic elements enable consolidation of multiple functions into a single device, reducing system BOM and board area.
• Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM supports large buffers and reduces dependence on external memory.
• Extensive I/O integration: 552 I/Os allow multi-channel connectivity and flexible interfacing without additional bridge components.
• Industrial temperature rating: −40 °C to 100 °C operation provides reliability for temperature-challenging installations.
• Compact high-density package: 1152-FBGA (35×35) delivers high pin count in a compact footprint for space-constrained designs.
• Low-voltage core: 0.82–0.88 V supply supports modern low-voltage system architectures and power-optimization efforts.

Why Choose 5SGXEA7H2F35I3?

The 5SGXEA7H2F35I3 positions itself as a high-capacity, industrial-grade FPGA option for designs that require significant logic resources, on-chip memory, and a large I/O complement in a compact package. Its combination of logic density, embedded RAM, and temperature range makes it suitable for robust, long-lived systems where integration and reliability matter.

Engineers targeting complex signal processing, multi-channel interfacing, or advanced control systems will find the device’s specifications aligned with high-integration board-level designs. RoHS compliance and surface-mount packaging support standard manufacturing flows.

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