5SGXEA7H2F35I2LN
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 51200000 622000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,319 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 552 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXEA7H2F35I2LN – Stratix® V GX Field Programmable Gate Array (FPGA)
The 5SGXEA7H2F35I2LN is an industrial-grade Stratix V GX FPGA IC designed for high-density, high-performance programmable logic implementations. This device combines a large core of programmable logic with substantial embedded memory and a high I/O count to address complex digital designs that require significant on-chip resources.
With 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 552 I/Os in a 1152-ball BGA/FCBGA package, the device is positioned for demanding industrial and high-speed communications applications where logic density, memory capacity, and board-level integration are critical.
Key Features
- Core Logic 622,000 logic elements provide extensive programmable logic capacity for implementing large-scale finite state machines, datapaths, and custom hardware accelerators.
- Configurable Logic Blocks (CLBs) 234,720 CLBs for structured logic partitioning and efficient resource mapping.
- Embedded Memory Approximately 51.2 Mbits of on-chip RAM to store large datasets, buffers, and state without external memory dependencies.
- I/O Resources 552 user I/Os to support wide parallel interfaces, multiple peripherals, and complex board-level routing requirements.
- Package and Mounting 1152-BBGA / FCBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor for compact, high-density PCB designs.
- Power and Supply Core voltage supply range of 820 mV to 880 mV to match system power domains and regulation strategies.
- Industrial Temperature Grade Operating temperature range from −40 °C to 100 °C for use in industrial and harsh-environment applications.
- Regulatory RoHS compliant, supporting environmental and lead-free assembly requirements.
Typical Applications
- High-speed serial communications Leverage the Stratix V GX family’s transceiver capabilities (family-level specifications) to implement multi-gigabit links and network interface functions.
- Memory-intensive signal processing Large on-chip RAM and extensive logic resources enable real-time buffering and processing for DSP, video, and streaming data pipelines.
- Industrial control and automation Industrial temperature rating and broad I/O count suit demanding control systems, motor drives, and factory automation equipment.
- Complex SoC prototyping High logic density and abundant I/Os allow hardware prototyping and integration of custom accelerators alongside standard interfaces.
Unique Advantages
- High logic density: 622,000 logic elements enable consolidation of large functions into a single device, reducing BOM and system complexity.
- Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM reduce reliance on external memory, improving latency and simplifying board design.
- Extensive I/O capability: 552 I/Os provide flexibility to interface with many peripherals and high-pin-count systems without additional bridging components.
- Industrial temperature support: Rated for −40 °C to 100 °C operation to meet the environmental needs of rugged and industrial deployments.
- Compact BGA package: 1152-ball BGA/FCBGA (1152-FBGA, 35×35) allows high integration density on modern PCBs while maintaining a surface-mount assembly flow.
- RoHS compliant: Supports lead-free manufacturing and environmental compliance requirements.
Why Choose 5SGXEA7H2F35I2LN?
The 5SGXEA7H2F35I2LN offers a balanced combination of high logic capacity, significant embedded memory, and generous I/O resources in an industrial-grade Stratix V GX FPGA. Its specifications make it well suited for designs requiring large-scale programmable logic, on-chip data storage, and robust interfacing in challenging operating environments.
For engineers and procurement teams building high-performance communications, industrial, or signal-processing systems, this device provides the integration and scalability needed to simplify board-level architecture while supporting long-term deployment in temperature-demanding applications.
Request a quote or submit a product inquiry to get pricing, availability, and additional procurement details for the 5SGXEA7H2F35I2LN.

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