5SGXEA7H2F35I3L

The 5SGXEA7H2F35I3L is an Intel Stratix® V GX field-programmable gate array (FPGA) in an industrial-grade 1152-BBGA (35×35 FCBGA) package. It delivers high on-chip logic and memory capacity with a large I/O count and is intended for applications that require dense programmable logic and high-speed I/O capability.

This device combines 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 552 I/Os, supporting designs that need significant integration of core logic, on-chip RAM, and extensive peripheral connectivity while operating across an industrial temperature range.

Key Features

• Logic Capacity  622,000 logic elements for implementing large, complex digital designs and custom logic blocks.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive processing functions.
• I/O Density  552 general-purpose I/Os to enable wide external connectivity and interface variety for peripherals and system-level I/O.
• Transceiver-Class Family  Stratix V GX devices (series-level) include high-speed transceiver capability per device family specifications, supporting the transceiver speed grades documented for the GX family.
• Power and Voltage  Core voltage range specified at 820 mV to 880 mV to align with low-voltage core power domains.
• Package & Mounting  1152-BBGA (FCBGA) 35×35 supplier device package supplied for surface-mount PCB assembly.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for industrial applications.
• Standards Compliance  RoHS compliant.

Typical Applications

• High‑speed communications and networking  Large logic capacity and family-level transceiver support make this device suitable for protocol processing, packet handling, and interface bridging tasks.
• Data processing and signal processing  Extensive on-chip RAM and high logic element count enable implementation of data-path engines, DSP blocks, and custom accelerators.
• Industrial control and instrumentation  Industrial temperature rating and high I/O count support robust control, monitoring, and I/O aggregation in industrial systems.
• Prototyping and system integration  High logic and I/O density allow system designers to consolidate multiple functions into a single programmable device for rapid prototyping and integration.

Unique Advantages

• High integration density: 622,000 logic elements and ~51.2 Mbits of embedded memory reduce the need for external logic and memory components.
• Extensive I/O capability: 552 I/Os provide flexibility for interfacing to a wide range of peripherals and high-pin-count systems.
• Industrial robustness: −40 °C to 100 °C operating range supports deployment in industrial environments.
• Compact FCBGA package: 1152-BBGA (35×35) footprint balances high pin count with a surface-mount form factor for dense PCB layouts.
• Low-voltage core operation: 820–880 mV core voltage range supports designs optimized for low-voltage FPGA cores.
• RoHS compliant: Meets common environmental requirements for electronic assemblies.

Why Choose 5SGXEA7H2F35I3L?

The 5SGXEA7H2F35I3L blends significant programmable logic resources, substantial embedded RAM, and a large I/O complement in an industrial-grade Stratix V GX device from Intel. It is positioned for system designs that require consolidated logic, heavy on-chip memory usage, and extensive external interfacing while operating across a broad temperature range.

This device is appropriate for engineering teams building high-density, high-connectivity FPGA-based systems who need a proven family-level feature set from the Stratix V GX series and a package suitable for surface-mount assembly and industrial deployments.

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