5SGXEA7H2F35I3W

The 5SGXEA7H2F35I3W is a Stratix V GX family FPGA IC designed for high-density, high-performance digital designs. It integrates a large programmable fabric, substantial on-chip memory, and a high I/O count in a 1152-ball BGA package for surface-mount applications. This industrial-grade device targets systems that require extensive logic capacity, significant embedded memory, and robust I/O routing.

Key Features

• Logic Capacity  622,000 logic elements (cells) provide a large programmable fabric for complex designs and high integration of digital functions.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive processing tasks.
• High I/O Count  552 device I/Os to simplify board-level connectivity and interface multiple peripherals or high-pin-count systems.
• Package & Mounting  1152-BBGA, FCBGA package; supplier device package listed as 1152-FBGA (35×35). Surface-mount mounting style supports standard PCB assembly.
• Power Supply  Core supply range specified at 820 mV to 880 mV for the device core.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for industrial-environment deployments.
• Regulatory  RoHS compliant.
• Stratix V GX/GT Series Transceiver Guidance  Series documentation for Stratix V devices describes GX transceiver speed grades up to 14.1 Gbps and GT grades up to 28.05 Gbps, as applicable to the Stratix V family.

Typical Applications

• High-speed communications  Systems requiring high-throughput serial links can leverage the Stratix V family transceiver speed grades documented for GX and GT channels.
• High-density logic and memory systems  Large logic capacity and approximately 51.2 Mbits of embedded memory support complex signal processing, protocol aggregation, and buffering tasks.
• Industrial control and instrumentation  Industrial temperature rating (−40 °C to 100 °C) and RoHS compliance suit factory automation, test equipment, and other industrial deployments.
• Board-level integration  High I/O count (552) and a 1152-ball BGA surface-mount package enable dense board connectivity and compact system designs.

Unique Advantages

• Substantial programmable fabric: 622,000 logic elements enable consolidation of multiple functions into a single device, reducing part count and system complexity.
• Large on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on external memory for many buffering and real-time processing tasks.
• Extensive I/O resources: 552 I/Os provide flexibility for interfacing to a wide range of peripherals, buses, and high-pin-count connectors without external GPIO expanders.
• Industrial temperature capability: −40 °C to 100 °C rating supports deployment in a wide range of environmental conditions common in industrial applications.
• Compact BGA packaging: 1152-ball BGA (supplier package 1152-FBGA, 35×35) allows high-density PCB routing while maintaining manufacturability through standard surface-mount assembly.

Why Choose 5SGXEA7H2F35I3W?

This Stratix V GX device combines large logic capacity, significant on-chip memory, and a high I/O count in a compact BGA package, making it well suited for industrial and high-performance systems that require integration of complex digital functions. The specified core voltage range and industrial temperature rating support deployment in demanding environments, while series documentation for Stratix V transceiver grades provides guidance for high-speed link integration.

Choose this device when your design demands a dense FPGA fabric with ample embedded memory and broad connectivity, and when industrial operating range and RoHS compliance are required.

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