5SGXEA7H3F35C2

The 5SGXEA7H3F35C2 is a Stratix V GX family FPGA delivering high on-chip logic capacity and extensive I/O in a compact FCBGA package. Built around the Stratix V GX architecture, this device combines substantial logic resources, embedded RAM, and support for high-speed transceiver grades documented in the Stratix V device datasheet.

Its feature set addresses designs that require high logic density, abundant I/O, and on-chip memory while operating in a commercial temperature grade and a surface-mount form factor.

Key Features

• Core Logic  Approximately 622,000 logic element cells and 234,720 LABs/CLBs provide a high-capacity fabric for complex logic and system integration.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, packet processing, and large state machines.
• I/O Density  552 user I/O pins to support wide external interfaces and multiple parallel buses.
• Transceiver Capability (Series-level)  Stratix V GX devices are covered by the device datasheet’s transceiver specifications and speed grades (series-level information includes transceiver grades up to 14.1 Gbps as documented for the Stratix V GX family).
• Power Supply  Core voltage range specified at 870 mV to 930 mV for design planning and power sequencing.
• Package & Mounting  1152-BBGA (FCBGA) supplier device package — 1152-FBGA (35×35) — optimized for surface-mount PCB assembly.
• Commercial Grade & Temperature  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-speed serial connectivity  Leverage the Stratix V GX transceiver grades documented in the datasheet (series-level) for designs requiring multiple high-speed serial links.
• High-density logic integration  Use the large logic element count and embedded RAM to implement complex state machines, protocol engines, or data-path processing within a single device.
• Multi‑interface systems  The device’s 552 I/O pins and compact FCBGA package make it suitable for boards that consolidate many peripheral interfaces in limited PCB area.

Unique Advantages

• Large programmable fabric: 622,000 logic element cells enable consolidation of complex functions and reduce the need for multiple discrete components.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM supports buffering and on-chip data handling, lowering external memory requirements.
• High I/O count: 552 I/Os accommodate wide buses, multiple peripherals, or high channel counts without sacrificing board-level routing flexibility.
• Compact, surface‑mount packaging: 1152-BBGA (35×35) FCBGA delivers high pin density in a board-friendly form factor for space-constrained applications.
• Commercial temperature rating: Defined 0 °C to 85 °C operating range for mainstream electronics applications.
• RoHS compliance: Meets environmental regulatory requirements for reduced hazardous substances.

Why Choose 5SGXEA7H3F35C2?

The 5SGXEA7H3F35C2 positions itself as a high-capacity Stratix V GX FPGA option for designs that require a combination of dense logic, ample embedded memory, and a large number of I/Os in a compact FCBGA package. Its documented core resources and series-level transceiver capability make it well suited for engineers consolidating complex digital functions and multiple interfaces onto a single programmable device.

For development and production, the device’s commercial grade, clearly specified operating conditions, and RoHS compliance deliver predictable behavior and environmental conformity for mainstream electronic products.

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