5SGXEA7H3F35C2LN

The 5SGXEA7H3F35C2LN is a Stratix® V GX family FPGA from Intel, delivered in a 1152-BBGA FCBGA package. It combines a high-density logic fabric with large on-chip memory and extensive I/O to support demanding digital designs and transceiver-enabled systems.

Designed for commercial temperature operation, the device provides a broad set of system-level capabilities—including a large logic element count, significant embedded RAM, and a wide I/O complement—while operating at a low core supply range for optimized power delivery.

Key Features

• High logic capacity — 622,000 logic elements and 234,720 logic array blocks to implement complex custom digital designs.
• Embedded memory — Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and lookup-table storage.
• I/O density — 552 programmable I/O pins to support broad peripheral and mezzanine connectivity.
• Transceiver-capable family — Stratix V GX devices include GX transceiver speed grades documented in the device datasheet (series-level speeds up to 14.1 Gbps), enabling high-speed serial interfaces where required.
• Low-voltage core — Core supply range of 820 mV to 880 mV to match system power-rail planning for modern high-density FPGAs.
• Package and mounting — Surface-mount 1152-BBGA (FCBGA) package; supplier device package listed as 1152-FBGA (35×35) for compact, high-pin-count board integration.
• Commercial temperature grade — Rated for operation from 0°C to 85°C for standard commercial applications.
• Regulatory compliance — RoHS compliant.

Typical Applications

• High-speed serial communication systems — Large logic and family-level GX transceivers support implementation of serial links and protocol engines that require high I/O bandwidth.
• Data-processing and acceleration — High logic element count and substantial on-chip RAM make the device suitable for hardware-accelerated data-paths and custom processing pipelines.
• Complex control and interface aggregation — Ample I/O and programmable fabric fit systems that consolidate multiple interfaces and control functions onto a single FPGA.

Unique Advantages

• Substantial programmable capacity: 622,000 logic elements provide the headroom to implement large-scale digital logic and state machines without external ASICs.
• Significant embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces reliance on external memory for moderate buffering and data staging needs.
• High I/O count: 552 I/O pins enable integration of many peripherals, mezzanine connectors, and parallel interfaces directly to the FPGA.
• Low core voltage: 820–880 mV core supply range aligns with modern power-delivery architectures for efficient operation.
• Compact, high-pin-count packaging: 1152-BBGA (35×35) FCBGA package offers a dense footprint for high-performance board designs.
• Commercial-grade reliability: Rated for 0°C to 85°C operation to meet typical commercial deployment environments.

Why Choose 5SGXEA7H3F35C2LN?

The 5SGXEA7H3F35C2LN positions itself as a high-capacity Stratix V GX FPGA option for designs that require a large programmable fabric, extensive embedded memory, and a high I/O count within a compact FCBGA package. Its low core-voltage operation and family-level transceiver capabilities support modern, power-conscious system architectures that also need high-speed serial connectivity.

Engineers and procurement teams targeting commercial-grade, high-density FPGA solutions will find this device appropriate for complex control, data processing, and interface-aggregation applications where a single, highly programmable device can reduce BOM complexity and accelerate time-to-market.

If you would like pricing, availability, or a formal quote for the 5SGXEA7H3F35C2LN, submit a request to receive detailed commercial information and ordering guidance.