5SGXEA7H3F35C2WN

The 5SGXEA7H3F35C2WN is a Stratix V GX family FPGA offering high logic density and substantial on-chip memory in a BGA package. It provides approximately 622,000 logic elements and approximately 51.2 Mbits of embedded memory, with up to 552 user I/O connections.

Designed as a commercial-grade device, this FPGA operates over a 0 °C to 85 °C range and uses a core voltage supply between 870 mV and 930 mV. The device is supplied in a 1152-ball FCBGA package (35 × 35 mm footprint).

Key Features

• Core and Logic  Approximately 622,000 logic elements to implement large-scale digital logic and custom processing functions.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for buffering, packet processing, and data-storage structures.
• I/O Density  Up to 552 user I/O pins to support wide parallel interfaces and multiple high-speed I/O lanes.
• Package  1152-ball FCBGA package (1152-BBGA, supplier package 1152-FBGA 35×35) for high pin-count board designs.
• Power  Core voltage supply range of 870 mV to 930 mV for the FPGA core.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Standards Compliance  RoHS compliant.
• Series Transceiver Capability (Series Document)  Stratix V GX family documentation references GX transceiver speed grades (series-level information) for high-speed channel operation.

Typical Applications

• High-density digital systems  Use the large logic element count and on-chip memory to implement complex custom logic, data-path acceleration, and protocol handling.
• High I/O interface designs  Leverage up to 552 I/O pins for wide parallel buses, multi-lane interfaces, or extensive peripheral connectivity.
• Communications and networking equipment  The Stratix V GX family documentation includes high-speed transceiver speed grades, making this FPGA suitable for designs that integrate high-speed serial channels alongside large programmable logic and memory.

Unique Advantages

• High logic density: Approximately 622,000 logic elements enable consolidation of multiple functions into a single FPGA, reducing external component count.
• Substantial on-chip RAM: Approximately 51.2 Mbits of embedded memory supports deep buffering, lookup tables, and state storage without relying on external memory for many use cases.
• Extensive I/O: Up to 552 user I/O pins provide flexibility for integrating parallel interfaces and numerous peripherals.
• High-pin-count BGA package: The 1152-ball FCBGA package supports dense board-level routing and high signal count in a 35 × 35 mm footprint.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to match commercial equipment environmental requirements.
• RoHS compliant: Aligns with common environmental compliance requirements for commercial electronics manufacturing.

Why Choose 5SGXEA7H3F35C2WN?

The 5SGXEA7H3F35C2WN delivers a blend of high logic capacity, significant on-chip RAM, and broad I/O count in a single commercial-grade Stratix V GX FPGA package. Its electrical characteristics—core voltage supply in the 870 mV to 930 mV range and an operating temperature window of 0 °C to 85 °C—make it suitable for demanding commercial applications that require consolidated programmable logic and memory resources.

This device is appropriate for engineers and system architects building complex digital systems, high-density interface boards, or communications equipment that benefit from the Stratix V GX family capabilities and package density.

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