5SGXEA7H3F35C3G

The 5SGXEA7H3F35C3G is a Stratix® V GX field programmable gate array (FPGA) from Intel, designed for high-density, memory-rich digital designs. It combines large programmable logic capacity with extensive I/O capability and embedded memory to support complex system integration.

This commercial-grade device operates over a 0 °C to 85 °C range, uses a low-voltage core supply (0.820 V to 0.880 V), and is RoHS compliant—attributes that make it suitable for demanding board-level designs where high logic density and significant on-chip RAM are required.

Key Features

• Core Logic  Provides 622,000 logic elements for implementing large-scale digital functions and complex algorithms.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffer memory, FIFOs, and state storage without external memory dependence.
• I/O Capacity  Up to 552 user I/Os to accommodate dense interfacing with peripherals, front-end electronics, and board-level connectivity.
• Power and Voltage  Core supply range of 0.820 V to 0.880 V to match low-voltage FPGA power domains and platform requirements.
• Package & Mounting  1152-BBGA FCBGA package (supplier device package: 1152-FBGA, 35×35) in a surface-mount form factor for high-density PCB assembly.
• Operating Grade  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital processing  Large logic element count and substantial on-chip RAM make this device appropriate for compute-heavy FPGA implementations and custom accelerators.
• Interface aggregation and I/O-heavy systems  With 552 I/Os, the device supports complex board-level interfacing and consolidation of multiple peripheral links.
• Communications and networking equipment  Stratix V GX devices are designed for designs that require significant logic and memory resources for packet processing and protocol handling.
• Platform prototyping and integration  The combination of logic density, memory, and high I/O count supports prototyping of system-on-chip functions and advanced system integration tasks.

Unique Advantages

• High logic density: 622,000 logic elements enable implementation of large, feature-rich FPGA designs without partitioning across multiple devices.
• Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces reliance on external memory and lowers system BOM complexity.
• Extensive I/O capability: 552 user I/Os simplify connection to diverse peripherals and enable dense board-level integration.
• Compact, high-density package: 1152-FBGA (35×35) package provides a high pin-count solution in a surface-mount form factor for space-constrained designs.
• Commercial-grade operating range: Rated 0 °C to 85 °C to match a wide range of commercial electronics environments.
• Low-voltage core operation: Core supply between 0.820 V and 0.880 V supports modern low-voltage power architectures.

Why Choose 5SGXEA7H3F35C3G?

The 5SGXEA7H3F35C3G delivers a balanced combination of large programmable logic capacity, significant embedded memory, and broad I/O resources in a high-density FCBGA package. As a member of the Stratix V GX family, it is engineered for designs that demand high integration and on-chip resources while remaining within commercial temperature and voltage domains.

This device is a solid choice for engineering teams building complex digital systems, communications hardware, and platform prototypes that require scalable logic and memory resources with a compact package and RoHS compliance.

Request a quote or submit an inquiry for pricing and availability to begin integrating the 5SGXEA7H3F35C3G into your next design.