5SGXEA7H3F35C4

The 5SGXEA7H3F35C4 is an Intel Stratix V GX family FPGA delivering high-density programmable logic and embedded memory in a 1152-ball FCBGA package. It combines large logic capacity and substantial on-chip RAM with a rich I/O count and commercial-temperature grading for demanding board-level digital designs.

Device electrical and switching characteristics—including core operating conditions and transceiver-related specifications—are documented in the Stratix V device datasheet, enabling design validation around performance, power, and I/O timing.

Key Features

• Logic Capacity  Approximately 622,000 logic elements for implementing large-scale digital designs and complex algorithms.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, large state machines, and memory-intensive processing.
• I/O Resources  552 user I/O pins to support broad peripheral and system interfacing requirements.
• Package and Mounting  1152-ball BGA (FCBGA) in a 35 × 35 mm supplier package; surface-mount mounting for standard PCB assembly flows.
• Core Voltage  Core supply range specified at 820 mV to 880 mV to define power-supply requirements for the FPGA core.
• Temperature and Grade  Commercial-grade device with an operating temperature range of 0 °C to 85 °C.
• Transceiver and Switching Characteristics  Stratix V GX family documentation covers transceiver specifications and switching characteristics for timing and signal integrity planning.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density digital systems  Implement large-scale logic and complex control functions using the device’s ~622k logic elements and extensive embedded memory.
• High-bandwidth I/O aggregation  Leverage 552 I/O pins to interface multiple peripherals, external memories, and high-pin-count subsystems.
• Board-level FPGA solutions  Surface-mount 1152-ball FCBGA packaging supports compact PCB designs that require significant programmable logic and memory on‑chip.

Unique Advantages

• Substantial logic resources: The large logic element count enables complex IP integration and extensive custom logic implementations without immediate part scaling.
• Significant on-chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependence on off-chip memory for many buffering and state-storage tasks.
• High I/O density: 552 I/O pins provide flexibility to connect to a variety of peripherals and high-pin-count interfaces directly.
• Robust package option for dense designs: 1152-ball FCBGA (35 × 35) provides a compact, board-friendly footprint for high-density systems.
• Documented electrical and switching data: Datasheet coverage of operating conditions, power, and transceiver characteristics supports accurate system-level design and validation.
• RoHS compliant: Meets environmental compliance expectations for many commercial product lines.

Why Choose 5SGXEA7H3F35C4?

The 5SGXEA7H3F35C4 positions itself as a high-density, commercially graded Stratix V GX FPGA that balances large programmable logic and embedded memory with a substantial I/O complement and industry-standard FCBGA packaging. Its documented electrical and switching characteristics help engineers define power, timing, and signal-integrity margins during system design and validation.

This device is suitable for designers and procurement teams targeting board-level solutions that require extensive on-chip resources, high I/O counts, and a commercial operating range, while benefiting from Intel’s Stratix V family documentation for implementation guidance.

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