5SGXEA7H3F35I3

The Intel Stratix® V GX device 5SGXEA7H3F35I3 is a high-density field programmable gate array supplied in an industrial-grade, surface-mount 1152-BBGA (35×35) package. Designed for the Stratix V GX family, the device provides large programmable logic capacity, substantial embedded memory, and advanced I/O resources for demanding digital and high-speed serial applications.

With 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 552 I/O pins, this device targets systems that require extensive logic integration, flexible I/O, and the electrical characteristics and thermal range needed for industrial environments.

Key Features

• Logic Capacity – 622,000 logic elements for implementing complex digital designs and large-scale programmable logic.
• Embedded Memory – Approximately 51.2 Mbits of on-chip RAM to support buffering, large LUTs, and state storage requirements.
• I/O Resources – 552 user I/O pins to accommodate extensive board-level connectivity and parallel interfaces.
• Package & Mounting – Supplied in an 1152-BBGA, FCBGA package (1152-FBGA, 35×35) for high-density, surface-mount PCB assembly.
• Power Supply – Core voltage supply range of 820 mV to 880 mV, enabling compatibility with low-voltage core power rails.
• Industrial Temperature Grade – Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
• Series-level Transceiver & I/O Capabilities – Stratix V GX family electrical and switching characteristics include transceiver specifications, I/O timing, and programmable I/O element delay as documented in the series datasheet.
• Compliance – RoHS compliant.

Typical Applications

• High-speed serial communications and transceivers – Leverage the Stratix V GX series transceiver and I/O timing capabilities for high-bandwidth serial links and protocol bridging.
• Industrial control and automation – Industrial-grade temperature range and extensive I/O make the device suitable for demanding embedded control systems.
• High-density logic integration – Large logic element count and substantial embedded RAM support complex state machines, protocol stacks, and data-path acceleration.
• Custom digital signal processing – On-chip memory and fast switching characteristics from the series datasheet enable implementation of DSP pipelines and buffering.

Unique Advantages

• High integration density: 622,000 logic elements and ~51.2 Mbits of embedded RAM consolidate large designs into a single device, reducing board-level component count.
• Extensive I/O capability: 552 I/O pins provide flexibility for multi-channel interfaces, wide data buses, and complex peripheral connectivity.
• Industrial-ready thermal range: −40 °C to 100 °C rating supports deployment in environments requiring extended temperature operation.
• Low-voltage core operation: Core supply range of 0.82–0.88 V aligns with modern low-voltage power architectures.
• RoHS-compliant supply: Environmentally compliant manufacturing and material practices.
• Proven series-level characteristics: Stratix V GX family documentation includes detailed electrical, switching, and transceiver specifications to aid design validation and system integration.

Why Choose 5SGXEA7H3F35I3?

The 5SGXEA7H3F35I3 combines very high logic density, sizeable embedded memory, and broad I/O resources in a single industrial-grade FCBGA package—making it well suited for designs that demand consolidation of complex functions, extensive interfacing, and reliable operation across extended temperatures. Its documented series-level electrical and transceiver characteristics support rigorous timing and high-speed serial use cases.

This device is appropriate for engineering teams building high-density, industrial embedded systems or advanced communication and signal-processing platforms that require long-term scalability, robust thermal performance, and a mature device family datasheet for design and validation.

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