5SGXEA7H3F35C4WN

The 5SGXEA7H3F35C4WN is a Stratix V GX Field Programmable Gate Array (FPGA) in a 1152‑BBGA FCBGA package. It combines a high logic capacity with substantial on‑chip memory and a large I/O count to support demanding, high‑density programmable logic designs.

Designed for commercial‑grade applications, this device provides a platform for complex custom logic, large memory buffers, and extensive external interfacing while operating within a nominal core supply range of 820 mV to 880 mV and a commercial temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  Approximately 622,000 logic elements, providing a large fabric for implementing complex digital logic and custom processors.
• Embedded Memory  Approximately 51.2 Mbits of embedded memory (on‑chip RAM) for large buffers, LUTRAM, or distributed storage.
• I/O Capacity  552 I/O pins, enabling broad connectivity to external devices, memory, and high‑density board designs.
• Power and Operating Range  Core supply voltage specified from 820 mV to 880 mV; commercial operating temperature from 0 °C to 85 °C.
• Package and Mounting  Surface‑mount 1152‑BBGA (supplier package: 1152‑FBGA, 35 × 35 mm) for compact, high‑density board integration.
• Compliance  RoHS compliant.
• Documented Electrical Characteristics  Device electrical and switching characteristics are covered in the Stratix V device datasheet, including operating conditions and transceiver information for the Stratix V family.

Typical Applications

• High‑density digital systems  Implement large, custom logic functions and accelerators using the device’s extensive logic element count and embedded memory.
• Communications and networking equipment  Stratix V GX family devices are described in the device datasheet with transceiver options; this device’s I/O capacity and FPGA fabric support complex protocol handling and packet processing architectures.
• Compute acceleration and DSP  Use the abundant logic resources and on‑chip RAM to build datapaths, pipelined engines, and buffering required for signal processing and hardware acceleration.

Unique Advantages

• Substantial logic capacity: The device’s ~622,000 logic elements let you map large designs without immediate partitioning across multiple devices.
• Large on‑chip memory: Approximately 51.2 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage needs.
• High I/O count: 552 I/Os provide the interface density needed for multi‑lane data paths, parallel peripherals, and external memory interfaces.
• Compact, manufacturable package: 1152‑BBGA FCBGA (35 × 35 mm) supports high‑density PCB layouts while remaining surface‑mount compatible.
• Commercial operating range: Rated for 0 °C to 85 °C, suitable for a wide range of commercial electronics applications.
• Regulatory readiness: RoHS compliance supports environmentally conscious production and procurement.

Why Choose 5SGXEA7H3F35C4WN?

The 5SGXEA7H3F35C4WN delivers a balanced combination of high logic density, abundant embedded memory, and extensive I/O in a compact 1152‑BBGA package. Its commercial temperature rating and documented electrical characteristics make it appropriate for demanding programmable logic designs requiring substantial on‑chip resources and connectivity.

This part is well suited to engineers and teams building high‑capacity FPGA solutions that require significant logic fabric and memory while maintaining a compact footprint and commercial temperature operation. The device’s specification set supports scalable designs and leverages the Stratix V device documentation for system‑level electrical and timing planning.

Request a quote or submit an inquiry to get pricing and availability information for the 5SGXEA7H3F35C4WN. Our team can provide lead‑time details and assist with technical questions to help you evaluate this Stratix V GX FPGA for your design.