5SGXEA7H3F35I3LG
| Part Description |
Stratix® V GX Field Programmable Gate Array (FPGA) IC 552 51200000 622000 1152-BBGA, FCBGA |
|---|---|
| Quantity | 118 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 552 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 234720 | Number of Logic Elements/Cells | 622000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 51200000 |
Overview of 5SGXEA7H3F35I3LG – Stratix V GX FPGA (1152-BBGA)
The 5SGXEA7H3F35I3LG is a Stratix® V GX field programmable gate array (FPGA) IC designed for industrial-grade programmable logic applications. It delivers large on-chip resources — including 622,000 logic elements and approximately 51.2 Mbits of embedded memory — together with a high I/O count and dense BGA packaging to address complex, high-capacity designs.
Targeted at industrial applications that require substantial logic density, abundant embedded RAM, and numerous I/O, this Stratix V GX device offers designers a balance of integration and configurability while operating across a wide temperature and supply range.
Key Features
- Core Logic 622,000 logic elements provide extensive programmable logic capacity for large-scale custom logic, signal processing, and complex state machines.
- Embedded Memory Approximately 51.2 Mbits of on-chip RAM for buffering, FIFOs, and memory-intensive functions without external memory dependence.
- I/O Density 552 I/O pins enable extensive external device interfacing and parallel connectivity for multi-channel systems.
- Packaging & Mounting 1152-BBGA (FCBGA) package, supplier device package 1152-FBGA (35×35), designed for surface-mount assembly to support compact, high-density PCB layouts.
- Voltage Supply Rated to operate from 820 mV to 880 mV, supporting the device’s core supply requirements.
- Temperature Range Industrial-grade operation from −40 °C to 100 °C to meet demanding environmental conditions.
- Standards & Compliance RoHS-compliant for regulatory alignment in lead-free assemblies.
- Stratix V GX Family Transceiver Options Stratix V GX device options in the family include transceiver channel rates up to 14.1 Gbps per the device datasheet (select appropriate speed grade for required channel rate).
Typical Applications
- Industrial Control & Automation Use the device’s industrial temperature rating, high logic capacity, and abundant I/O to implement complex control algorithms, real-time processing, and multi-sensor interfaces.
- High-Density Signal Processing Large embedded RAM and extensive logic resources support buffering and parallel data-path implementations for DSP, packet processing, and custom accelerators.
- High-Speed Connectivity Stratix V GX transceiver options and many I/Os make the device suitable for designs requiring high-throughput serial or parallel links (choose appropriate transceiver speed grade per datasheet).
Unique Advantages
- Substantial Logic Capacity: 622,000 logic elements reduce the need for multi-device partitioning by accommodating large designs in a single FPGA.
- Large On-Chip Memory: Approximately 51.2 Mbits of embedded RAM lowers external memory dependence and simplifies PCB routing for memory-heavy functions.
- High I/O Count: 552 I/O pins offer flexible connectivity options for multi-channel interfaces, peripherals, and system expansion.
- Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in harsh or temperature-variable environments.
- Compact, High-Density Packaging: 1152-BBGA (35×35 FCBGA) enables dense board-level integration while supporting surface-mount manufacturing.
- Regulatory Compliance: RoHS compliance simplifies inclusion in modern, lead-free assemblies.
Why Choose 5SGXEA7H3F35I3LG?
The 5SGXEA7H3F35I3LG Stratix V GX FPGA pairs significant logic and memory resources with a high I/O count and industrial temperature tolerance, making it well suited to engineers building large-scale, high-capacity systems. Its packaging and supply voltage range support dense board designs and standard surface-mount processes.
For designs that require scalability, robust operating range, and substantial on-chip resources, this Stratix V GX device provides a quantifiable platform purpose-built for industrial applications and complex logic workloads. Refer to the device datasheet for speed-grade and transceiver configuration options when selecting the appropriate variant for your design.
Request a quote or submit an inquiry to receive pricing and availability details for 5SGXEA7H3F35I3LG and to discuss specific speed-grade and packaging requirements for your application.

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