5SGXEA7H3F35I3N

The 5SGXEA7H3F35I3N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 1152‑BBGA (1152‑FBGA, 35×35) surface‑mount package. It provides a large logic capacity, substantial embedded memory, and extensive I/O to support complex, high‑density industrial designs.

With industrial temperature grading and RoHS compliance, this device is specified for use where robust thermal range, high I/O count and significant on‑chip resources are required. Key on‑chip resources include 622,000 logic elements and approximately 51.2 Mbits of embedded RAM.

Key Features

• Logic Capacity — 622,000 logic elements suited for large, complex FPGA designs and high integration of digital functions.
• Embedded Memory — Approximately 51.2 Mbits of on‑chip RAM to support deep buffering, state storage, and memory‑intensive algorithms.
• I/O Density — 552 user I/Os to accommodate high‑pin count interfaces and multi‑lane connectivity requirements.
• Package & Mounting — 1152‑BBGA (Supplier package: 1152‑FBGA, 35×35), surface mount for compact board integration and high I/O routing density.
• Industrial Grade & Temperature Range — Industrial grade device rated for −40 °C to 100 °C operating temperature.
• Power Supply — Core voltage specification within 820 mV to 880 mV to support defined power budgeting and supply design.
• Environmental Compliance — RoHS compliant to meet regulatory requirements for lead‑free assemblies.

Typical Applications

• Industrial Control Systems — Large logic capacity and industrial temperature range enable complex control algorithms, motor control and industrial protocol bridging.
• Communications Infrastructure — High I/O count and substantial embedded RAM support dense interface aggregation and packet buffering functions.
• Signal Processing and Acceleration — Large number of logic elements and on‑chip memory for implementing parallel compute blocks, filters, and data path acceleration.

Unique Advantages

• High Logic Density: 622,000 logic elements provide the headroom to consolidate multiple functions into a single FPGA, reducing overall system BOM.
• Significant On‑Chip Memory: Approximately 51.2 Mbits of embedded RAM supports deep buffering and complex state machines without relying exclusively on external memory.
• Ample I/O Resources: 552 I/Os simplify interfacing to multi‑lane transceivers, parallel buses, and mixed I/O domains.
• Industrial‑Rated Operation: Specified for −40 °C to 100 °C, enabling deployment in demanding temperature environments.
• Compact, High‑Density Package: 1152‑BBGA / 1152‑FBGA (35×35) provides a space‑efficient footprint for high‑pin‑count designs.
• Standards‑Oriented Supply: RoHS compliant and manufactured by Intel, aligning with common procurement and environmental requirements.

Why Choose 5SGXEA7H3F35I3N?

The 5SGXEA7H3F35I3N combines large logic resources, extensive embedded memory and a high I/O count in a compact 1152‑BBGA package, making it a practical choice for industrial designs that require consolidation of complex digital functions. Its industrial temperature rating and defined supply voltage range support robust deployment and predictable power design.

This device is well suited to engineering teams and procurement organizations building high‑density FPGA solutions where on‑chip resources, I/O capacity and industrial operating range are key selection criteria.

Request a quote or submit a sourcing inquiry to obtain pricing, lead times and availability for the 5SGXEA7H3F35I3N Stratix® V GX FPGA.