5SGXEA7H3F35I3G

The 5SGXEA7H3F35I3G is an Intel Stratix V GX family FPGA optimized for designs that require very large programmable logic capacity and extensive I/O. This industrial-grade device combines a high logic element count with substantial on-chip RAM and an FCBGA package suitable for surface-mount applications.

Key attributes include 622,000 logic elements, approximately 51.2 Mbits of embedded memory, 552 I/O pins, and an industrial operating range of −40 °C to 100 °C, making it appropriate for demanding embedded and communications designs that require robust temperature performance and high integration.

Key Features

• Core Logic  Provides 622,000 logic elements for large-scale programmable logic and complex designs.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, large state machines, and data processing tasks.
• I/O Density  552 user I/O pins to accommodate wide peripheral arrays, parallel interfaces, and dense system integration.
• Package & Mounting  1152-BBGA (FCBGA) supplier device package, listed as 1152-FBGA (35×35), designed for surface-mount board assembly.
• Power  Core supply range specified at 820 mV to 880 mV for core voltage planning and power delivery design.
• Temperature Grade  Industrial grade with specified operating range of −40 °C to 100 °C for extended environmental operation.
• Compliance  RoHS compliant, supporting lead-free manufacturing and environmental requirements.

Typical Applications

• High‑speed communications  Leverages the GX-class architecture and large logic/memory resources for transceiver-based designs and protocol processing.
• Industrial control and automation  Industrial temperature rating and high I/O count suit factory automation, motion control, and heavy-environment embedded controllers.
• Data processing and acceleration  Large logic elements and on-chip RAM enable algorithm acceleration, signal processing, and custom compute blocks.
• Complex system integration  High I/O density and large FPGA fabric allow consolidation of multiple functions into a single device to reduce system BOM and board area.

Unique Advantages

• High logic capacity: 622,000 logic elements give headroom for complex state machines, DSP pipelines, and large control fabrics.
• Substantial embedded memory: Approximately 51.2 Mbits of on-chip RAM reduces dependence on external memory for many buffering and data‑path needs.
• Extensive I/O availability: 552 I/O pins support broad peripheral connectivity and parallel interfaces without additional IO expanders.
• Industrial robustness: Specified operation from −40 °C to 100 °C for reliable performance across a wide range of environments.
• Compact FCBGA package: 1152-ball FCBGA (35×35) enables high-density board layouts while supporting surface-mount assembly processes.
• Controlled core voltage range: 0.82–0.88 V core supply specification aids precise power-supply design and thermal budgeting.

Why Choose 5SGXEA7H3F35I3G?

The 5SGXEA7H3F35I3G positions itself as a high-density, industrial-grade Stratix V GX FPGA suitable for designs that demand extensive logic resources, large embedded memory, and substantial I/O capacity. Its package and supply specifications support compact board integration and controlled power delivery, while the industrial temperature rating extends operational reliability in challenging environments.

Engineers and system designers who need to consolidate functions, accelerate processing, or implement transceiver-enabled communications logic will find this device suitable for scalable, robust implementations backed by Intel's Stratix V device family documentation.

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