5SGXEA7H3F35C4G

The 5SGXEA7H3F35C4G is a Stratix V GX Field Programmable Gate Array (FPGA) in a 1152-BBGA FCBGA package. It combines a high logic count with abundant embedded memory and extensive I/O to support dense, configurable digital designs.

Designed for commercial applications, this device provides 622,000 logic elements, approximately 51.2 Mbits of on-chip RAM, and 552 user I/Os—making it suitable for I/O‑heavy systems and large-scale custom logic implementations.

Key Features

• Logic Capacity  622,000 logic elements and 234,720 LABs provide substantial programmable logic for complex digital functions and custom datapaths.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM for packet buffering, FIFOs, lookup tables, and local data storage.
• I/O Density  552 user I/Os to support multiple parallel interfaces, broad sensor/PHY connectivity, and board-level integration.
• Package & Mounting  1152-BBGA (supplier package: 1152-FBGA, 35×35) in a surface-mount FCBGA format for compact system integration.
• Power Supply  Core voltage range specified at 820 mV to 880 mV to match platform power sequencing and regulation requirements.
• Commercial Temperature Grade  Rated for operation from 0°C to 85°C, aligned with commercial‑grade system deployments.
• Environmental Compliance  RoHS compliant, supporting regulatory and manufacturing requirements.

Typical Applications

• I/O‑Dense Systems  Boards and systems that require many parallel or mixed I/O interfaces can leverage the device’s 552 user I/Os for broad peripheral and PHY connectivity.
• Large Custom Logic Implementations  Designs needing extensive programmable logic—such as complex state machines, custom datapaths, or protocol offloads—can use the device’s 622,000 logic elements and 234,720 LABs.
• On‑Chip Memory‑Intensive Functions  Applications that require embedded buffering, packet handling, or local storage can take advantage of approximately 51.2 Mbits of on‑chip RAM.

Unique Advantages

• High Logic and Memory Integration:  Combining 622,000 logic elements with about 51.2 Mbits of embedded RAM reduces the need for external memory and simplifies board-level design.
• Extensive I/O Count:  With 552 user I/Os, the device supports multiple simultaneous interfaces, lowering the complexity of system interconnects.
• Compact Package for Dense Designs:  The 1152‑FBGA (35×35) FCBGA package enables high-density placement on compact PCBs while maintaining surface‑mount assembly compatibility.
• Commercial Temperature Rating:  Specified for 0°C to 85°C, the device is suitable for standard commercial environments and product lines.
• Regulatory Readiness:  RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose 5SGXEA7H3F35C4G?

The 5SGXEA7H3F35C4G positions itself as a high‑capacity, I/O‑rich Stratix V GX FPGA for commercial designs that demand large programmable logic, substantial on‑chip memory, and flexible interfacing. Its core voltage specification and FCBGA packaging enable integration into sophisticated boards where dense logic and memory resources are required.

This device is well suited to engineers and teams building systems that need to consolidate logic and buffering on a single device, reduce external component count, and maintain a compact PCB footprint, while operating within commercial temperature and power envelopes.

Request a quote or submit an inquiry to obtain pricing, availability, and lead‑time details for the 5SGXEA7H3F35C4G.