5SGXEA7H3F35C3N

The 5SGXEA7H3F35C3N is a Stratix® V GX field programmable gate array (FPGA) from Intel, provided in a 1152-ball BGA package for surface-mount assembly. This commercial-grade device combines high logic capacity, abundant embedded memory, and a large I/O count to support complex, high-density FPGA designs.

With a core supply range of 0.82–0.88 V and an operating temperature range of 0 °C to 85 °C, the device targets applications that require significant on-chip resources and extensive connectivity within commercial temperature environments.

Key Features

• High Logic Capacity 622,000 logic elements provide substantial resources for complex algorithms, custom accelerators, and large digital designs.
• Embedded Memory Approximately 51.2 Mbits of on-chip RAM to support buffering, large lookup tables, and state storage without external memory.
• Extensive I/O 552 user I/O pins enable broad system-level interfacing and multiple high-pin-count connections to peripherals and board-level interfaces.
• Package and Mounting 1152-BBGA (supplier package: 1152-FBGA (35x35)) in a surface-mount form factor for compact, high-density PCB designs.
• Core Voltage Specified core supply range of 820 mV to 880 mV for power planning and supply design.
• Commercial Temperature Grade Rated for operation from 0 °C to 85 °C suitable for commercial electronics applications.
• Standards Compliance RoHS compliant to meet environmental and manufacturing requirements.

Typical Applications

• High-density FPGA designs Use the device where large logic capacity and significant on-chip RAM are required to implement complex digital systems and processing pipelines.
• Protocol and interface aggregation Leverage 552 I/Os for multi-protocol bridging, large bus interfacing, and dense connector ecosystems on the board.
• Commercial compute acceleration Deploy the FPGA as a programmable fabric to offload computational tasks requiring many logic elements and embedded memory.

Unique Advantages

• Large native logic resources: 622,000 logic elements reduce the need for multi-FPGA partitioning on large designs.
• Significant embedded memory: Approximately 51.2 Mbits of on-chip RAM supports large buffers and memory-intensive functions without immediate external-memory dependency.
• High I/O count: 552 I/Os enable flexible system integration and high-pin-count connectivity for complex boards.
• Compact, manufacturable package: 1152-BBGA (1152-FBGA supplier package) supports surface-mount assembly for dense PCB layouts.
• Commercial temperature rating: Operation from 0 °C to 85 °C aligns with a wide range of commercial electronic products and environments.
• Regulatory compliance: RoHS compliance simplifies environmental qualification and global manufacturing requirements.

Why Choose 5SGXEA7H3F35C3N?

The 5SGXEA7H3F35C3N positions itself as a high-capacity Stratix V GX FPGA for commercial designs that demand extensive programmable logic, substantial on-chip memory, and a large number of I/Os in a single surface-mount package. Its core voltage range and temperature rating provide grounding for system-level power and thermal planning.

Design teams seeking a high-density, RoHS-compliant FPGA with broad connectivity and embedded memory resources will find this Intel Stratix V GX device appropriate for consolidating functions, reducing board-level complexity, and accelerating development of resource-intensive digital systems.

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