5SGXEA7H3F35C2N

The 5SGXEA7H3F35C2N is a Stratix® V GX Field Programmable Gate Array (FPGA) IC from Intel, supplied in a 1152-BBGA FCBGA package. It delivers a large programmable fabric with substantial on-chip memory and a high I/O count for demanding commercial designs.

Designed for applications that require significant logic capacity, embedded RAM, and numerous I/O, this device provides a compact surface-mount package, a low-voltage core supply range, and commercial temperature operation.

Key Features

• Core logic capacity  622,000 logic elements (cells) provide extensive resources for complex custom logic and RTL designs.
• Embedded memory  Approximately 51.2 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-mapped designs.
• I/O and connectivity  552 user I/Os enable dense external device interfacing and complex board-level connectivity.
• Transceiver family (series-level)  Stratix V GX series transceiver options are documented with channel speed grades up to 14.1 Gbps per GX channel in the device family.
• Power and core supply  Core supply range specified at 870 mV to 930 mV for the FPGA core domain.
• Package and mounting  1152-BBGA (FCBGA) package, supplier device package 1152-FBGA (35×35), intended for surface-mount assembly.
• Commercial temperature grade  Rated for operation from 0°C to 85°C for commercial applications.
• Regulatory compliance  RoHS compliant.

Typical Applications

• High-density custom logic  Use the large logic element count and on-chip RAM to implement substantial custom datapaths, control logic, and compute kernels within a single device.
• Compact, I/O-intensive systems  Leverage 552 I/Os and the 1152-BBGA package to manage dense board routing and multiple external interfaces in space-constrained designs.
• Multi-gigabit interface designs  Deploy Stratix V GX series transceiver capabilities for designs requiring multi-gigabit channel support as documented for the family.
• Commercial embedded systems  Target commercial-temperature embedded products that need a combination of high logic capacity, embedded memory, and controlled core voltage operation.

Unique Advantages

• High logic density: 622,000 logic elements enable consolidation of complex functions into one FPGA, reducing board-level component count.
• Substantial embedded RAM: Approximately 51.2 Mbits of on-chip memory supports large data buffering and on-chip storage without external memory dependency.
• Extensive I/O capability: 552 user I/Os facilitate integration with a wide range of peripherals, sensors, and high-pin-count interfaces.
• Surface-mount, compact package: 1152-BBGA (35×35) FCBGA delivers a space-efficient footprint for high-density board layouts.
• Commercial operating range and compliance: 0°C to 85°C rating and RoHS compliance meet common commercial product requirements.
• Low-voltage core operation: 870–930 mV core supply range supports contemporary low-voltage power architectures.

Why Choose 5SGXEA7H3F35C2N?

The 5SGXEA7H3F35C2N combines large programmable logic resources, substantial embedded memory, and a high I/O count in a compact 1152-BBGA surface-mount package, making it well suited for commercial designs that demand significant on-chip capacity and dense connectivity. Its specification set aligns with applications requiring multi-gigabit transceiver options within the Stratix V GX family, controlled core voltage, and commercial temperature operation.

Engineers and system designers seeking to consolidate complex logic and memory-intensive functions into a single FPGA will find this device a practical option for reducing board complexity while maintaining the resource headroom needed for advanced designs.

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