5SGXEA7H3F35C2G

The 5SGXEA7H3F35C2G is a Stratix V GX field programmable gate array (FPGA) in a 1152-ball FCBGA package, offered as a commercial-grade device. It combines a high logic capacity, substantial embedded memory, and a large I/O count to address complex, high-density programmable logic designs.

Designed for applications that require significant on-chip resources and flexible I/O, this device delivers 622,000 logic elements, approximately 51.2 Mbits of embedded memory, and 552 I/O pins in a 35 × 35 mm FBGA footprint, with core supply operation between 870 mV and 930 mV.

Key Features

• Logic Capacity  622,000 logic elements for implementing large-scale digital logic and complex custom architectures.
• Embedded Memory  Approximately 51.2 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive algorithms without external memory dependency.
• I/O Density  552 available I/O pins to accommodate wide parallel interfaces, multiple high-speed links, and extensive board routing requirements.
• Package & Mounting  1152-ball FCBGA package (1152-FBGA, 35×35 mm) with surface-mount mounting for high-density board integration.
• Power Requirements  Core voltage supply range of 870 mV to 930 mV, suitable for designs targeting low-voltage core operation.
• Temperature & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Standards & Compliance  RoHS-compliant manufacturing and materials status.
• Supported Family Characteristics  Part of the Stratix V family; device documentation includes electrical and switching characteristics, I/O timing, and transceiver-related specifications for architects referencing family-level performance.

Typical Applications

• High-density digital signal processing  Large logic capacity and substantial on-chip RAM enable implementation of complex DSP pipelines and parallel computation engines.
• Network and communications equipment  High I/O count supports multi-lane interfaces and dense board-level connectivity for networking line cards and protocol processing.
• Storage and data acceleration  Embedded memory and logic resources can be used for buffering, packet processing, and custom acceleration functions in data center hardware.

Unique Advantages

• High logic and memory integration: 622,000 logic elements combined with approximately 51.2 Mbits of embedded RAM reduce reliance on external components for many complex functions.
• Large I/O availability: 552 I/O pins provide flexibility for interfacing multiple peripherals, wide data buses, and high-pin-count modules without multiplexing compromises.
• Compact, industry-standard package: 1152-ball FCBGA (35×35 mm) offers a dense package option for space-constrained boards while enabling robust routing and thermal performance.
• Low-voltage core operation: Core supply range of 870–930 mV supports designs targeting low-voltage FPGA cores and associated power architectures.
• Commercial temperature grade: Rated for 0 °C to 85 °C operation, suitable for a wide range of commercial and enterprise applications.
• Regulatory compliance: RoHS-compliant status supports environmental and manufacturing compliance requirements.

Why Choose 5SGXEA7H3F35C2G?

The 5SGXEA7H3F35C2G positions itself as a high-capacity Stratix V GX FPGA delivering substantial logic, memory, and I/O resources in a single, commercial-grade FCBGA package. Its combination of 622,000 logic elements, approximately 51.2 Mbits of embedded RAM, and 552 I/Os makes it well suited for designs that require large on-chip integration and flexible interfacing without expanding board-level complexity.

Engineers and procurement teams targeting scalable, high-density programmable logic for communications, data processing, and acceleration platforms will find this device offers a balanced set of attributes—performance-oriented resources, a compact 1152-ball package, and RoHS compliance—backed by device-level documentation for system integration and verification.

Request a quote or submit an RFQ to evaluate the 5SGXEA7H3F35C2G for your next design.