5SGXEA7H3F35C2LG

The 5SGXEA7H3F35C2LG is a Stratix V GX field programmable gate array supplied in a 1152-BBGA FCBGA package. This commercial-grade FPGA provides a large logic fabric, extensive embedded memory, and high I/O density for complex programmable logic designs.

Designed for applications that demand significant on-chip resources and flexible I/O routing, the device delivers high integration with a low-voltage core supply and a standard commercial operating temperature range.

Key Features

• Logic Capacity  Includes 622,000 logic elements and 234,720 logic cells to support large-scale logic integration and complex designs.
• Embedded Memory  Provides approximately 51.2 Mbits of on-chip RAM for dense buffering, FIFOs, and memory-intensive functions.
• I/O Resources  Offers 552 user I/O pins to support broad peripheral connectivity and high pin-count interfaces.
• Package  Supplied in a 1152-BBGA (1152-FBGA, 35×35) FCBGA surface-mount package to accommodate high-density board designs.
• Power  Core supply voltage range of 820 mV to 880 mV to match low-voltage, high-performance FPGA power domains.
• Temperature & Grade  Commercial grade device rated for an operating temperature range of 0 °C to 85 °C.
• Mounting  Surface-mount package suitable for standard PCB assembly processes.
• Compliance  RoHS compliant, supporting regulatory requirements for lead-free manufacturing.

Typical Applications

• High-density logic designs  Large logic capacity and extensive embedded RAM enable implementation of complex state machines, datapaths, and custom accelerators.
• High-pin-count systems  With 552 I/O, the device suits designs requiring many external interfaces or parallel buses.
• Memory-intensive functions  Approximately 51.2 Mbits of on-chip memory supports large FIFOs, buffering, and table storage without immediate external memory dependence.

Unique Advantages

• Substantial logic resources: 622,000 logic elements allow consolidation of multi-module designs onto a single FPGA, reducing system complexity.
• Large embedded memory: Approximately 51.2 Mbits of RAM minimizes external memory needs for many applications, simplifying board layout and BOM.
• High I/O density: 552 I/O pins provide flexibility to interface with multiple peripherals, sensors, and high-speed buses.
• Compact high-density package: 1152-BBGA (35×35) FCBGA offers a small footprint for high-resource FPGAs in space-constrained designs.
• Low-voltage core operation: 0.82–0.88 V supply supports modern low-voltage power architectures and can help optimize power delivery design.
• Commercial availability: Rated for 0 °C to 85 °C operation to meet standard commercial product deployment requirements.

Why Choose 5SGXEA7H3F35C2LG?

The 5SGXEA7H3F35C2LG combines a very large logic fabric, substantial embedded memory, and extensive I/O in a compact FCBGA package, making it suitable for complex programmable designs where integration and I/O flexibility are priorities. Its commercial-grade rating and RoHS compliance make it appropriate for mainstream electronic products and systems operating within standard temperature ranges.

For engineers and procurement teams seeking a high-capacity Stratix V GX device with defined electrical and packaging characteristics, this part offers a balanced platform for scaling designs while leveraging the Stratix V family’s documented electrical and switching characteristics.

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